产品系列
MSP430F2274MRHATEP
- Manufacturer : Texas Instruments
Packaging : Cut Tape (CT)
Alternate Packaging
Series : MSP430F2xx
Part Status : Active
Core Processor : MSP430
Core Size : 16-Bit
Speed : 16MHz
Connectivity : I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals : Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O : 32
Program Memory Size : 32KB (32K x 8 + 256B)
Program Memory Type : FLASH
RAM Size : 1K x 8
Voltage - Supply (Vcc/Vdd) : 1.8V ~ 3.6V
Data Converters : A/D 12x10b
Oscillator Type : Internal
Operating Temperature : -55°C ~ 125°C (TA)
Mounting Type : Surface Mount
Package / Case : 40-VFQFN Exposed Pad
Supplier Device Package : 40-VQFN (6x6)
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| LM3677LEE-1.5/NOPB | TI | 6-LLP (2.0x1.5) | New | 详细 | |
| TL7705BIP | TI | 8-PDIP | New | 详细 | |
| TPS51285BRUKT | TI | 20-WQFN (3x3) | New | 详细 | |
| BQ7692006PWR | TI | 20-TSSOP | New | 详细 | |
| CD74AC20E | TI | 14-PDIP | New | 详细 | |
| TPS61088RHLR | TI | 20-VQFN (3.5x4.5) | New | 详细 | |
| THS3125CDG4 | TI | 14-SOIC | New | 详细 | |
| DAC38RF87IAAV | TI | 144-FCBGA (10x10) | New | 详细 | |
| OPA875IDGKR | TI | 8-VSSOP | New | 详细 | |
| LDCCOILEVM | TI | New | 详细 | ||
| TPIC6B596DWG4 | TI | 20-SOIC | New | 详细 | |
| TL851CDR | TI | 16-SOIC | New | 详细 | |
| ADS8484IBRGZT | TI | 48-VQFN (7x7) | New | 详细 | |
| LMV712IDGSTG4 | TI | 10-VSSOP | New | 详细 | |
| BQ24257RGET | TI | 24-VQFN (4x4) | New | 详细 | |
| UCC28230DRNT | TI | 12-USON (3x2) | New | 详细 | |
| TPS61106PWRG4 | TI | 20-TSSOP | New | 详细 | |
| TPS61181AEVM-259 | TI | New | 详细 | ||
| 74LVC1G126DBVRG4 | TI | SOT-23-5 | New | 详细 | |
| LP8340CDTX-2.5/NOPB | TI | TO-252-3 | New | 详细 |
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