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  • MSP430F2274TDAR

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : MSP430F2xx
    Part Status : Active
    Core Processor : MSP430
    Core Size : 16-Bit
    Speed : 16MHz
    Connectivity : I2C, IrDA, LINbus, SCI, SPI, UART/USART
    Peripherals : Brown-out Detect/Reset, POR, PWM, WDT
    Number of I/O : 32
    Program Memory Size : 32KB (32K x 8 + 256B)
    Program Memory Type : FLASH
    RAM Size : 1K x 8
    Voltage - Supply (Vcc/Vdd) : 1.8V ~ 3.6V
    Data Converters : A/D 12x10b
    Oscillator Type : Internal
    Operating Temperature : -40°C ~ 105°C (TA)
    Mounting Type : Surface Mount
    Package / Case : 38-TSSOP (0.240", 6.10mm Width)
    Supplier Device Package : 38-TSSOP

极速报价

型号
品牌 封装 批号 查看
MAX3243ECRHBR TI 32-VQFN (5x5) New 详细
LMC6442AIMX TI 8-SOIC New 详细
TPS7A4501DCQT TI SOT-223-6 New 详细
CD74AC374M96 TI New 详细
TPS5403EVM TI New 详细
DS90CR286AMTD TI 56-TSSOP New 详细
LMV1032UP-25/NOPB TI 4-DSBGA New 详细
ADS8284IBRGCT TI 64-VQFN (9x9) New 详细
TPS61087DSCT TI 10-WSON (3x3) New 详细
TPSM84A21MOJT TI 20-QFM (9x15) New 详细
LM3940IS-3.3/NOPB TI DDPAK/TO-263-3 New 详细
TPL9201N TI 20-PDIP New 详细
TPS51623RSMR TI 32-VQFN (4x4) New 详细
TPS65012RGZR TI 48-VQFN (7x7) New 详细
TLE2082ACP TI 8-PDIP New 详细
TLV75515PDRVR TI 6-WSON (2x2) New 详细
MSP430F2616TPMR TI 64-LQFP (10x10) New 详细
DP83620-EVK/NOPB TI New 详细
74ABT16600DGGRG4 TI 56-TSSOP New 详细
LP3965EMP-3.3 TI SOT-223-5 New 详细