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  • MSP430F2274TRHAR

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : MSP430F2xx
    Part Status : Active
    Core Processor : MSP430
    Core Size : 16-Bit
    Speed : 16MHz
    Connectivity : I2C, IrDA, LINbus, SCI, SPI, UART/USART
    Peripherals : Brown-out Detect/Reset, POR, PWM, WDT
    Number of I/O : 32
    Program Memory Size : 32KB (32K x 8 + 256B)
    Program Memory Type : FLASH
    RAM Size : 1K x 8
    Voltage - Supply (Vcc/Vdd) : 1.8V ~ 3.6V
    Data Converters : A/D 12x10b
    Oscillator Type : Internal
    Operating Temperature : -40°C ~ 105°C (TA)
    Mounting Type : Surface Mount
    Package / Case : 40-VFQFN Exposed Pad
    Supplier Device Package : 40-VQFN (6x6)

极速报价

型号
品牌 封装 批号 查看
DS25CP152QSQ/NOPB TI 16-WQFN (4x4) New 详细
LM3S300-IQN25-C2 TI 48-LQFP (7x7) New 详细
XAM5718ABCXE TI 760-FCBGA (23x23) New 详细
BQ35100PWR TI 14-TSSOP New 详细
LM25118EVAL/NOPB TI New 详细
TLV320AIC14IDBTR TI 30-TSSOP New 详细
HPC3130APGEG4 TI 144-LQFP (20x20) New 详细
UCD9081RHBR TI 32-VQFN (5x5) New 详细
SN74LVC2G66YEAR TI 8-DSBGA, 8-WCSP (1.9x0.9) New 详细
PCM2906DB TI 28-SSOP New 详细
DLPC2607ZVB TI 176-NFBGA (7x7) New 详细
SN65HVD232QDR TI 8-SOIC New 详细
74ACT11004DWR TI 20-SOIC New 详细
BQ500410ARGZR TI 48-VQFN (7x7) New 详细
LP38692MP-5.0 TI SOT-223-5 New 详细
LM3S611-IGZ50-C2 TI 48-VQFN (7x7) New 详细
LMH6658MA TI 8-SOIC New 详细
TPS2010PWR TI 14-TSSOP New 详细
TMDXDOCK28027 TI New 详细
LP3965ES-5.0/NOPB TI DDPAK/TO-263-5 New 详细