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  • MSP430F233TRGCR

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : MSP430F2xx
    Part Status : Active
    Core Processor : MSP430
    Core Size : 16-Bit
    Speed : 16MHz
    Connectivity : I2C, IrDA, LINbus, SCI, SPI, UART/USART
    Peripherals : Brown-out Detect/Reset, POR, PWM, WDT
    Number of I/O : 48
    Program Memory Size : 8KB (8K x 8 + 256B)
    Program Memory Type : FLASH
    RAM Size : 1K x 8
    Voltage - Supply (Vcc/Vdd) : 1.8V ~ 3.6V
    Data Converters : A/D 8x12b
    Oscillator Type : Internal
    Operating Temperature : -40°C ~ 105°C (TA)
    Mounting Type : Surface Mount
    Package / Case : 64-VFQFN Exposed Pad
    Supplier Device Package : 64-VQFN (9x9)

极速报价

型号
品牌 封装 批号 查看
FDC1004QEVM TI New 详细
TLIN1024RGYRQ1 TI 24-VQFN (5.5x3.5) New 详细
LM2586SX-12 TI DDPAK/TO-263-7 New 详细
SN74LVC1G07YZVR TI 4-DSBGA (0.88x0.88) New 详细
DAC081C085CIMM/NOPB TI 8-VSSOP New 详细
TPS62237DRYT TI 6-SON (1.45x1) New 详细
LM4040BIM3-5.0 TI SOT-23-3 New 详细
LM3S9792-IBZ80-C3 TI 108-BGA (10x10) New 详细
CC1111F8RSP TI New 详细
TL4051C12IDBZT TI SOT-23-3 New 详细
TPS78915DBVR TI SOT-23-5 New 详细
SN74LVC1G08DBVT TI SOT-23-5 New 详细
ADS8361EVM TI New 详细
TPS24742RGER TI New 详细
TPS62410QDRCRQ1 TI 10-VSON (3x3) New 详细
BQ2019PWR TI 8-TSSOP New 详细
TPS2202AIDBR TI 30-SSOP New 详细
LMX2594EVM TI New 详细
TMS32C6713BGDPA200 TI 272-BGA (27x27) New 详细
TSU8111YFPR TI 20-DSBGA New 详细