产品系列

罗斌森
  • MSP430F2370IYFFT

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : MSP430F2xx
    Part Status : Active
    Core Processor : MSP430
    Core Size : 16-Bit
    Speed : 16MHz
    Connectivity : I2C, IrDA, LINbus, SCI, SPI, UART/USART
    Peripherals : Brown-out Detect/Reset, POR, PWM, WDT
    Number of I/O : 32
    Program Memory Size : 32KB (32K x 8 + 256B)
    Program Memory Type : FLASH
    RAM Size : 2K x 8
    Voltage - Supply (Vcc/Vdd) : 1.8V ~ 3.6V
    Data Converters : Slope A/D
    Oscillator Type : Internal
    Operating Temperature : -40°C ~ 85°C (TA)
    Mounting Type : Surface Mount
    Package / Case : 49-UFBGA, DSBGA
    Supplier Device Package : 49-DSBGA (2.8x2.8)

极速报价

型号
品牌 封装 批号 查看
SN65HVD230QD TI 8-SOIC New 详细
LM2575HVSX-15/NOPB TI DDPAK/TO-263-5 New 详细
LM3S2139-EQC25-A2T TI 100-LQFP (14x14) New 详细
LM4050AEM3-2.0/NOPB TI SOT-23-3 New 详细
TCA9509RVHR TI 8-X2QFN (1.6x1.6) New 详细
LM46001PWP TI 16-HTSSOP New 详细
TPA302D TI 8-SOIC New 详细
TPS82671EVM-646 TI New 详细
LM3S1332-IQC50-A2 TI 100-LQFP (14x14) New 详细
REG102UA-3.3 TI 8-SOIC New 详细
LP2985AIM5-3.6/NOPB TI SOT-23-5 New 详细
TPS3110K33DBVT TI SOT-23-6 New 详细
TLV2772MDRG4 TI 8-SOIC New 详细
LM2903PWRG4 TI 8-TSSOP New 详细
TLV1117LV30DCYR TI SOT-223-4 New 详细
SN74LVC1G126DCKR TI SC-70-5 New 详细
LP3855EMP-3.3 TI SOT-223-5 New 详细
HDC1050DMBT TI 6-WSON (3x3) New 详细
SN74ACT7811-20PN TI 80-LQFP (12x12) New 详细
SN74ALS32NSR TI 14-SOP New 详细