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  • MSP430F47187IPZ

  • Manufacturer : Texas Instruments
    Packaging : Tray
    Alternate Packaging
    Series : MSP430x4xx
    Part Status : Active
    Core Processor : MSP430
    Core Size : 16-Bit
    Speed : 16MHz
    Connectivity : I2C, IrDA, LINbus, SCI, SPI, UART/USART
    Peripherals : Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
    Number of I/O : 68
    Program Memory Size : 116KB (116K x 8)
    Program Memory Type : FLASH
    RAM Size : 8K x 8
    Voltage - Supply (Vcc/Vdd) : 1.8V ~ 3.6V
    Data Converters : A/D 7x16b
    Oscillator Type : Internal
    Operating Temperature : -40°C ~ 85°C (TA)
    Mounting Type : Surface Mount
    Package / Case : 100-LQFP
    Supplier Device Package : 100-LQFP (14x14)

极速报价

型号
品牌 封装 批号 查看
TSC2007IYZGR TI 12-DSBGA New 详细
LM3S1968-IQC50-A2T TI 100-LQFP (14x14) New 详细
LP38501TSX-ADJ/NOPB TI DDPAK/TO-263-5 New 详细
LP3907SQX-VRZX/NOPB TI 24-WQFN (4x4) New 详细
TLV272QDRQ1 TI 8-SOIC New 详细
PCI6420GHK TI 288-BGA Microstar (16x16) New 详细
TPS40003DGQRG4 TI 10-MSOP-PowerPad New 详细
LM2597N-ADJ TI 8-PDIP New 详细
TPS65950BZXN TI 209-NFBGA New 详细
TLE2021QDRG4Q1 TI 8-SOIC New 详细
LP3961ES-1.8 TI DDPAK/TO-263-5 New 详细
SN74LVTH373PWR TI 20-TSSOP New 详细
ISO7342CDW TI 16-SOIC New 详细
SN74LS157DR TI 16-SOIC New 详细
SN74LVC4245APWG4 TI 24-TSSOP New 详细
SAFETI-HSK-570LS31 TI New 详细
SN74F241DWR TI 20-SOIC New 详细
TLV62568PEVM-860 TI New 详细
LP3966ET-3.3/NOPB TI TO-220-5 New 详细
SN74AUP1T57DCKR TI SC-70-6 New 详细