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  • MSP430F5171IRSBR

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : MSP430F5xx
    Part Status : Active
    Core Processor : CPUXV2
    Core Size : 16-Bit
    Speed : 25MHz
    Connectivity : I2C, IrDA, SCI, SPI, UART/USART
    Peripherals : Brown-out Detect/Reset, DMA, POR, PWM, WDT
    Number of I/O : 31
    Program Memory Size : 32KB (32K x 8)
    Program Memory Type : FLASH
    RAM Size : 2K x 8
    Voltage - Supply (Vcc/Vdd) : 1.8V ~ 3.6V
    Oscillator Type : Internal
    Operating Temperature : -40°C ~ 85°C (TA)
    Mounting Type : Surface Mount
    Package / Case : 40-WFQFN Exposed Pad
    Supplier Device Package : 40-WQFN (5x5)

极速报价

型号
品牌 封装 批号 查看
TCAN1051HVDRBTQ1 TI 8-SON (3x3) New 详细
LMV393IDRG4 TI 8-SOIC New 详细
UCC2818DW TI 16-SOIC New 详细
LM3S9D81-IQC80-A2 TI 100-LQFP (14x14) New 详细
DAC716UK/1KG4 TI 16-SOIC New 详细
TLV2452AIDR TI 8-SOIC New 详细
UA9638CD TI 8-SOIC New 详细
SN74AHC132DGVR TI 14-TVSOP New 详细
AFE7222IRGC25 TI 64-VQFN (9x9) New 详细
TLV1117IKTER TI 3-PowerFLEX? New 详细
TLV2475CPWPR TI 16-HTSSOP New 详细
SN74LVC1G08YEPR TI 5-DSBGA, 5-WCSP (1.4x0.9) New 详细
LM27342QMYX/NOPB TI 10-MSOP-PowerPad New 详细
LM3S9U92-IBZ80-A1T TI 108-BGA (10x10) New 详细
LP3871ET-5.0/NOPB TI TO-220-5 New 详细
TLV320AIC12IDBT TI 30-TSSOP New 详细
TFP101PZP TI 100-HTQFP (14x14) New 详细
ADC101S101CISDX TI 6-WSON (2.2x2.5) New 详细
OPA2316IDR TI 8-SOIC New 详细
LP3871ES-1.8 TI DDPAK/TO-263-5 New 详细