产品系列

罗斌森
  • MSP430F5224IRGZT

  • Manufacturer : Texas Instruments
    Packaging : Tape & Reel (TR)
    Alternate Packaging
    Series : MSP430F5xx
    Part Status : Obsolete
    Core Processor : CPUXV2
    Core Size : 16-Bit
    Speed : 25MHz
    Connectivity : I2C, IrDA, SCI, SPI, UART/USART
    Peripherals : Brown-out Detect/Reset, DMA, POR, PWM, WDT
    Number of I/O : 17
    Program Memory Size : 128KB (128K x 8)
    Program Memory Type : FLASH
    RAM Size : 8K x 8
    Voltage - Supply (Vcc/Vdd) : 1.8V ~ 3.6V
    Data Converters : A/D 10x10b
    Oscillator Type : Internal
    Operating Temperature : -40°C ~ 85°C (TA)
    Mounting Type : Surface Mount
    Package / Case : 48-VFQFN Exposed Pad
    Supplier Device Package : 48-VQFN (7x7)

极速报价

型号
品牌 封装 批号 查看
UC382TDTR-2G3 TI DDPAK/TO-263-5 New 详细
SN74ALVC16244AZQLR TI 56-BGA MICROSTAR JUNIOR (7.0x4.5) New 详细
LM4840LQ/NOPB TI 28-WQFN (5x5) New 详细
TLC2202ACD TI 14-SOIC New 详细
MSP430F1611IRTDT TI 64-VQFN (9x9) New 详细
TLV274QDRQ1 TI 14-SOIC New 详细
TPS77930DGKRG4 TI 8-VSSOP New 详细
LP3923TL-VC/NOPB TI 30-TuSMD New 详细
OPA4277UAE4 TI 14-SOIC New 详细
LM2577T-12/LF03 TI TO-220-5 New 详细
LMD18201T/NOPB TI TO-220-11 New 详细
ADS7800BH TI 24-CDIP New 详细
LM336D-2-5 TI 8-SOIC New 详细
BQ501210RGCT TI 64-VQFN (9x9) New 详细
BQ24072TRGTT TI 16-QFN (3x3) New 详细
LP3961ET-1.8/NOPB TI TO-220-5 New 详细
ISO7421AQDRQ1 TI 8-SOIC New 详细
MC3486DR TI 16-SOIC New 详细
SN65HVD73DR TI 14-SOIC New 详细
LP3875ES-1.8 TI DDPAK/TO-263-5 New 详细