产品系列
MSP430F5257IRGCR
- Manufacturer : Texas Instruments
Packaging : Cut Tape (CT)
Alternate Packaging
Series : MSP430F5xx
Part Status : Active
Core Processor : CPUXV2
Core Size : 16-Bit
Speed : 25MHz
Connectivity : I2C, IrDA, SCI, SPI, UART/USART
Peripherals : Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O : 53
Program Memory Size : 128KB (128K x 8)
Program Memory Type : FLASH
RAM Size : 16K x 8
Voltage - Supply (Vcc/Vdd) : 1.8V ~ 3.6V
Data Converters : A/D 12x10b
Oscillator Type : Internal
Operating Temperature : -40°C ~ 85°C (TA)
Mounting Type : Surface Mount
Package / Case : 64-VFQFN Exposed Pad
Supplier Device Package : 64-VQFN (9x9)
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| TPS54561EVM-555 | TI | New | 详细 | ||
| CSD25402Q3A | TI | 8-VSON (3.3x3.3) | New | 详细 | |
| RI-I11-114A-01 | TI | New | 详细 | ||
| TMS320C6711DGDP250 | TI | 272-BGA (27x27) | New | 详细 | |
| OPA4132UA/2K5 | TI | 14-SOIC | New | 详细 | |
| SN74CBT3125PW | TI | 14-TSSOP | New | 详细 | |
| LM3940LDX-3.3 | TI | 8-WSON (4x4) | New | 详细 | |
| TLV4379IPWR | TI | 14-TSSOP | New | 详细 | |
| TPS65030YZKR | TI | 25-DSBGA | New | 详细 | |
| LM3S1850-IBZ50-A2 | TI | 108-BGA (10x10) | New | 详细 | |
| LM4040DIM3-2.0/NOPB | TI | SOT-23-3 | New | 详细 | |
| LM3S9B92-IQC80-C1T | TI | 100-LQFP (14x14) | New | 详细 | |
| SN65C1167EPWR | TI | 16-TSSOP | New | 详细 | |
| TPS2557QDRBRQ1 | TI | 8-SON (3x3) | New | 详细 | |
| LP8345CLDX-5.0/NOPB | TI | 6-WSON (2.92x3.29) | New | 详细 | |
| LP2982AIM5-5.0 | TI | SOT-23-5 | New | 详细 | |
| LMC6464AIM/NOPB | TI | 14-SOIC | New | 详细 | |
| SN74AS574N | TI | New | 详细 | ||
| CY74FCT2541ATQCT | TI | 20-SSOP/QSOP | New | 详细 | |
| LM79L12ACMX/NOPB | TI | 8-SOIC | New | 详细 |
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