产品系列
MSP430F5309IRGZR
- Manufacturer : Texas Instruments
Packaging : Cut Tape (CT)
Alternate Packaging
Series : MSP430F5xx
Part Status : Active
Core Processor : CPUXV2
Core Size : 16-Bit
Speed : 25MHz
Connectivity : I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals : Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O : 31
Program Memory Size : 24KB (24K x 8)
Program Memory Type : FLASH
RAM Size : 6K x 8
Voltage - Supply (Vcc/Vdd) : 1.8V ~ 3.6V
Data Converters : A/D 8x10b
Oscillator Type : Internal
Operating Temperature : -40°C ~ 85°C (TA)
Mounting Type : Surface Mount
Package / Case : 48-VFQFN Exposed Pad
Supplier Device Package : 48-VQFN (7x7)
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| UCC28634DR | TI | 7-SOIC | New | 详细 | |
| LMC6484AIMX | TI | 14-SOIC | New | 详细 | |
| LMZ31704RVQR | TI | 42-B3QFN (10x10) | New | 详细 | |
| BQ27546EVM-702 | TI | New | 详细 | ||
| TLV73315PDQNR | TI | 4-X2SON (1x1) | New | 详细 | |
| LP2982IM5-4.0/NOPB | TI | SOT-23-5 | New | 详细 | |
| LP5907UVX-3.2/NOPB | TI | 4-DSBGA | New | 详细 | |
| MSP430F2272IRHAR | TI | 40-VQFN (6x6) | New | 详细 | |
| CD74HC688M96 | TI | New | 详细 | ||
| LP5900SD-2.8 | TI | 6-WSON (2.2x2.5) | New | 详细 | |
| BQ27531YZFR-G1 | TI | 15-DSBGA | New | 详细 | |
| DS90C402MX/NOPB | TI | 8-SOIC | New | 详细 | |
| TLV2472IP | TI | 8-PDIP | New | 详细 | |
| LM5161PWPBKEVM | TI | New | 详细 | ||
| TPS78630KTTRG3 | TI | DDPAK/TO-263-5 | New | 详细 | |
| XAM1808AZCG4 | TI | 361-NFBGA (13x13) | New | 详细 | |
| TPS65111RGER | TI | 24-VQFN (4x4) | New | 详细 | |
| SM320F2812PGFMEP | TI | 176-LQFP (24x24) | New | 详细 | |
| LM2674LD-ADJ/NOPB | TI | 16-WSON (5x5) | New | 详细 | |
| LM3620M5X-4 | TI | SOT-23-5 | New | 详细 |
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