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MSP430F5324IRGCR
- Manufacturer : Texas Instruments
Packaging : Cut Tape (CT)
Alternate Packaging
Series : MSP430F5xx
Part Status : Active
Core Processor : CPUXV2
Core Size : 16-Bit
Speed : 25MHz
Connectivity : I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals : Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O : 47
Program Memory Size : 64KB (64K x 8)
Program Memory Type : FLASH
RAM Size : 6K x 8
Voltage - Supply (Vcc/Vdd) : 1.8V ~ 3.6V
Data Converters : A/D 12x12b
Oscillator Type : Internal
Operating Temperature : -40°C ~ 85°C (TA)
Mounting Type : Surface Mount
Package / Case : 64-VFQFN Exposed Pad
Supplier Device Package : 64-VQFN (9x9)
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| LM2594MX-5.0/NOPB | TI | 8-SOIC | New | 详细 | |
| MSP430F2617TPNR | TI | 80-LQFP (12x12) | New | 详细 | |
| LMK03200EVAL/NOPB | TI | New | 详细 | ||
| TAS5028APAGG4 | TI | 64-TQFP (10x10) | New | 详细 | |
| INA145UA | TI | 8-SOIC | New | 详细 | |
| CD4060BNSR | TI | 16-SO | New | 详细 | |
| SN74AHC158NSRG4 | TI | 16-SO | New | 详细 | |
| TPS72625KTTT | TI | DDPAK/TO-263-5 | New | 详细 | |
| AFE4900YZT | TI | 30-DSBGA (2.6x2.1) | New | 详细 | |
| LMP7702MM/NOPB | TI | 8-VSSOP | New | 详细 | |
| LMH6321TS/NOPB | TI | DDPAK/TO-263-7 | New | 详细 | |
| TXS0101DCKR | TI | SC-70-6 | New | 详细 | |
| PCA9515APW | TI | 8-TSSOP | New | 详细 | |
| ISO7721QDRQ1 | TI | 8-SOIC | New | 详细 | |
| MSP430G2755IRHA40T | TI | 40-VQFN (6x6) | New | 详细 | |
| LP3963ESX-3.3 | TI | DDPAK/TO-263-5 | New | 详细 | |
| ADS7823-28EVM | TI | New | 详细 | ||
| MSP-EXP430FR2311 | TI | New | 详细 | ||
| CC2538NF23RTQR | TI | 56-QFN (8x8) | New | 详细 | |
| 74FCT162240ATPACT | TI | 48-TSSOP | New | 详细 |
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