产品系列
MSP430F5338IPZ
- Manufacturer : Texas Instruments
Packaging : Tray
Alternate Packaging
Series : MSP430F5xx
Part Status : Active
Core Processor : CPUXV2
Core Size : 16-Bit
Speed : 20MHz
Connectivity : I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals : Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O : 74
Program Memory Size : 256KB (256K x 8)
Program Memory Type : FLASH
RAM Size : 18K x 8
Voltage - Supply (Vcc/Vdd) : 1.8V ~ 3.6V
Data Converters : A/D 16x12b; D/A 2x12b
Oscillator Type : Internal
Operating Temperature : -40°C ~ 85°C (TA)
Mounting Type : Surface Mount
Package / Case : 100-LQFP
Supplier Device Package : 100-LQFP (14x14)
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| TLC27M4BID | TI | 14-SOIC | New | 详细 | |
| SN74ABT651DW | TI | 24-SOIC | New | 详细 | |
| DB-LM3S101 | TI | New | 详细 | ||
| TPS78227DDCT | TI | SOT-23-5 | New | 详细 | |
| LF411ACN/NOPB | TI | 8-PDIP | New | 详细 | |
| LM3S9GN5-IQC80-A1 | TI | 100-LQFP (14x14) | New | 详细 | |
| TRS3223IDBG4 | TI | 20-SSOP | New | 详细 | |
| OPA452TA-1G3 | TI | TO-220-7 | New | 详细 | |
| LM3559TLX/NOPB | TI | 16-DSBGA (2.5x2.12) | New | 详细 | |
| LP3965ES-2.5 | TI | DDPAK/TO-263-5 | New | 详细 | |
| TLC2262AQDRG4 | TI | 8-SOIC | New | 详细 | |
| SN74LVC2G14YEAR | TI | 6-DSBGA, 6-WCSP (1.4x0.9) | New | 详细 | |
| TPS25940LRVCR | TI | 20-WQFN (4x3) | New | 详细 | |
| OMAP3503DCUS | TI | 423-FCBGA (16x16) | New | 详细 | |
| SN65ELT20D | TI | 8-SOIC | New | 详细 | |
| LM3S6C11-IBZ80-A1 | TI | 108-BGA (10x10) | New | 详细 | |
| LM98714BCMT/NOPB | TI | 48-TSSOP | New | 详细 | |
| TPS546C23EVM2-746 | TI | New | 详细 | ||
| ESD122DMXR | TI | 3-X2SON (1x0.6) | New | 详细 | |
| TLC2551CDGK | TI | 8-VSSOP | New | 详细 |
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