产品系列

罗斌森
  • MSP430F5359IPZ

  • Manufacturer : Texas Instruments
    Packaging : Tray
    Alternate Packaging
    Series : MSP430F5xx
    Part Status : Active
    Core Processor : CPUXV2
    Core Size : 16-Bit
    Speed : 20MHz
    Connectivity : I2C, IrDA, SCI, SPI, UART/USART
    Peripherals : Brown-out Detect/Reset, DMA, POR, PWM, WDT
    Number of I/O : 74
    Program Memory Size : 512KB (512K x 8)
    Program Memory Type : FLASH
    RAM Size : 66K x 8
    Voltage - Supply (Vcc/Vdd) : 1.8V ~ 3.6V
    Data Converters : A/D 16x12b; D/A 2x12b
    Oscillator Type : Internal
    Operating Temperature : -40°C ~ 85°C (TA)
    Mounting Type : Surface Mount
    Package / Case : 100-LQFP
    Supplier Device Package : 100-LQFP (14x14)

极速报价

型号
品牌 封装 批号 查看
LP5952TLX-1.3/NOPB TI 5-DSBGA (1.41x1.08) New 详细
TPS75533KTTR TI DDPAK/TO-263-5 New 详细
TRS3318IDBRG4 TI 20-SSOP New 详细
ADS8166IRHBT TI 32-VQFN (5x5) New 详细
SN74CBT3383PWR TI 24-TSSOP New 详细
OPA4727AIPW TI 14-TSSOP New 详细
INA4180A4QPWRQ1 TI 14-TSSOP New 详细
DAC5672IPFBR TI 48-TQFP (7x7) New 详细
LM317MQDCYRG3 TI SOT-223-4 New 详细
LM3S1D21-IBZ80-A2 TI 108-BGA (10x10) New 详细
TPS76201DBVR TI SOT-23-5 New 详细
TPS2046AD TI 8-SOIC New 详细
TPS3808G01DBVR TI SOT-23-6 New 详细
LM311N/NOPB TI 8-PDIP New 详细
74FCT2244ATSOCTG4 TI 20-SOIC New 详细
LM1117SX-5.0/NOPB TI DDPAK/TO-263-3 New 详细
LP3872ESX-1.8 TI DDPAK/TO-263-5 New 详细
TPS70912DBVR TI SOT-23-5 New 详细
TMP100NA/250 TI SOT-23-6 New 详细
LMV796MF TI SOT-23-5 New 详细