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  • MSP430F5502IRGZR

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : MSP430F5xx
    Part Status : Active
    Core Processor : CPUXV2
    Core Size : 16-Bit
    Speed : 25MHz
    Connectivity : I2C, IrDA, SCI, SPI, UART/USART, USB
    Peripherals : Brown-out Detect/Reset, DMA, POR, PWM, WDT
    Number of I/O : 31
    Program Memory Size : 24KB (24K x 8)
    Program Memory Type : FLASH
    RAM Size : 6K x 8
    Voltage - Supply (Vcc/Vdd) : 1.8V ~ 3.6V
    Oscillator Type : Internal
    Operating Temperature : -40°C ~ 85°C (TA)
    Mounting Type : Surface Mount
    Package / Case : 48-VFQFN Exposed Pad
    Supplier Device Package : 48-VQFN (7x7)

极速报价

型号
品牌 封装 批号 查看
MAX3238IDBQ1 TI 28-SSOP New 详细
LP38843T-1.2 TI TO-220-5 New 详细
LM26001EVAL TI New 详细
TPS23757EVM TI New 详细
SN74AHC08QPWRG4Q1 TI 14-TSSOP New 详细
BQ500211RGZR TI 48-VQFN (7x7) New 详细
CD74HC4066M96 TI 14-SOIC New 详细
LM2679S-12/NOPB TI DDPAK/TO-263-7 New 详细
LP3874ESX-3.3 TI DDPAK/TO-263-5 New 详细
TLV707185PDQNR TI 4-X2SON (1x1) New 详细
TLV2432CDR TI 8-SOIC New 详细
ADS1110A0IDBVR TI SOT-23-6 New 详细
LMP7702MM TI 8-VSSOP New 详细
SN74LVT16244BDGVR TI 48-TVSOP New 详细
LP2986AILDX-3.3/NOPB TI 8-WSON (4x4) New 详细
LP2994M/NOPB TI 8-SOIC New 详细
TPS70933EVM-110 TI New 详细
TPS79920YZUT TI 5-DSBGA (1x1.37) New 详细
TXS0206AEVM TI New 详细
LM5111-3MYX/NOPB TI 8-MSOP-PowerPad New 详细