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  • MSP430F5503IRGZT

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : MSP430F5xx
    Part Status : Active
    Core Processor : CPUXV2
    Core Size : 16-Bit
    Speed : 25MHz
    Connectivity : I2C, IrDA, LINbus, SCI, SPI, UART/USART, USB
    Peripherals : Brown-out Detect/Reset, DMA, POR, PWM, WDT
    Number of I/O : 31
    Program Memory Size : 32KB (32K x 8)
    Program Memory Type : FLASH
    RAM Size : 6K x 8
    Voltage - Supply (Vcc/Vdd) : 1.8V ~ 3.6V
    Oscillator Type : Internal
    Operating Temperature : -40°C ~ 85°C (TA)
    Mounting Type : Surface Mount
    Package / Case : 48-VFQFN Exposed Pad
    Supplier Device Package : 48-VQFN (7x7)

极速报价

型号
品牌 封装 批号 查看
LM4871LD/NOPB TI 8-WSON (4x4) New 详细
TLK2211RCPR TI 64-HVQFP New 详细
RI-TRP-D9TD TI New 详细
LM2904MX/NOPB TI 8-SOIC New 详细
SN74AS175BNSR TI New 详细
SN74LV166APWT TI 16-TSSOP New 详细
DAC5675IPHP TI 48-HTQFP (7x7) New 详细
MUX506IPWR TI 28-TSSOP New 详细
MSC1211Y4PAGRG4 TI 64-TQFP (10x10) New 详细
LM4050QAEM3X4.1/NOPB TI SOT-23-3 New 详细
TPS7A4533DCQT TI SOT-223-6 New 详细
TRF1112IRGZT TI 48-VQFN (7x7) New 详细
CD4060BM96G4 TI 16-SOIC New 详细
TMS320C6414TBGLZA8 TI 532-FCBGA (23x23) New 详细
LP3981ILDX-2.7/NOPB TI 6-WSON (3x4) New 详细
TLV320AIC3111IRHBT TI 32-VQFN (5x5) New 详细
LP3966ESX-3.3 TI DDPAK/TO-263-5 New 详细
CD4077BPWRG4 TI 14-TSSOP New 详细
SN74LV1T86DCKRG4 TI SC-70-5 New 详细
TP13067BDW TI 20-SOIC New 详细