产品系列
MSP430F5507IRGZT
- Manufacturer : Texas Instruments
Packaging : Cut Tape (CT)
Alternate Packaging
Series : MSP430F5xx
Part Status : Active
Core Processor : CPUXV2
Core Size : 16-Bit
Speed : 25MHz
Connectivity : I2C, IrDA, LINbus, SCI, SPI, UART/USART, USB
Peripherals : Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O : 31
Program Memory Size : 32KB (32K x 8)
Program Memory Type : FLASH
RAM Size : 6K x 8
Voltage - Supply (Vcc/Vdd) : 1.8V ~ 3.6V
Data Converters : A/D 8x10b
Oscillator Type : Internal
Operating Temperature : -40°C ~ 85°C (TA)
Mounting Type : Surface Mount
Package / Case : 48-VFQFN Exposed Pad
Supplier Device Package : 48-QFN (7x7)
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| TLV5633IPWR | TI | 20-TSSOP | New | 详细 | |
| TPS65150RGER | TI | 24-VQFN (4x4) | New | 详细 | |
| UCC2800N | TI | 8-PDIP | New | 详细 | |
| PGA900AYZSR | TI | 36-DSBGA (3.72x3.56) | New | 详细 | |
| L293NG4 | TI | 16-PDIP | New | 详细 | |
| LM3S6952-EQC50-A2 | TI | 100-LQFP (14x14) | New | 详细 | |
| TPS3307-33DGN | TI | 8-MSOP-PowerPad | New | 详细 | |
| CD74HC241M | TI | 20-SOIC | New | 详细 | |
| TLE2144CDW | TI | 16-SOIC | New | 详细 | |
| LM4040BIM3X-2.5 | TI | SOT-23-3 | New | 详细 | |
| ADC3423EVM | TI | New | 详细 | ||
| LP3892EMR-1.8 | TI | 8-SO PowerPad | New | 详细 | |
| TMDSHVRESLLCKIT | TI | New | 详细 | ||
| TRSF3232CPWG4 | TI | 16-TSSOP | New | 详细 | |
| LM3S9GN5-IQC80-A2T | TI | 100-LQFP (14x14) | New | 详细 | |
| TLV2344IPWR | TI | 14-TSSOP | New | 详细 | |
| UCC27525DR | TI | 8-SOIC | New | 详细 | |
| LM3S812-EQN50-C2 | TI | 48-LQFP (7x7) | New | 详细 | |
| OPA2336E/2K5 | TI | 8-VSSOP | New | 详细 | |
| TLC083IDGQ | TI | 10-MSOP-PowerPad | New | 详细 |
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