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  • MSP430F5510IRGZT

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : MSP430F5xx
    Part Status : Active
    Core Processor : CPUXV2
    Core Size : 16-Bit
    Speed : 25MHz
    Connectivity : I2C, IrDA, LINbus, SCI, SPI, UART/USART, USB
    Peripherals : Brown-out Detect/Reset, DMA, POR, PWM, WDT
    Number of I/O : 31
    Program Memory Size : 32KB (32K x 8)
    Program Memory Type : FLASH
    RAM Size : 6K x 8
    Voltage - Supply (Vcc/Vdd) : 1.8V ~ 3.6V
    Data Converters : A/D 8x10b
    Oscillator Type : Internal
    Operating Temperature : -40°C ~ 85°C (TA)
    Mounting Type : Surface Mount
    Package / Case : 48-VFQFN Exposed Pad
    Supplier Device Package : 48-VQFN (7x7)

极速报价

型号
品牌 封装 批号 查看
OPA2705EA/250 TI 8-VSSOP New 详细
UC2842AD8 TI 8-SOIC New 详细
TLV333IDCKT TI SC-70-5 New 详细
UC385TD-2 TI DDPAK/TO-263-5 New 详细
TPS61260EVM-673 TI New 详细
THS3062DDARG3 TI 8-SO PowerPad New 详细
SN74LV4051ANSR TI 16-SO New 详细
LM2832YMY EVAL TI New 详细
CSD17575Q3T TI 8-VSON-CLIP (3.3x3.3) New 详细
SN74F241NSR TI 20-SO New 详细
CD74HC238E TI 16-PDIP New 详细
SN74ALVC32DGVR TI 14-TVSOP New 详细
ADS8482IBRGZT TI 48-VQFN (7x7) New 详细
THS3125CPWPR TI 14-HTSSOP New 详细
TLK2201RCPR TI 64-HVQFP New 详细
TFP101PZP TI 100-HTQFP (14x14) New 详细
LM2678S-ADJ/NOPB TI DDPAK/TO-263-7 New 详细
REG103FA-3KTTT TI DDPAK/TO-263-5 New 详细
TLC7701ID TI 8-SOIC New 详细
LP3470M5-2.63/NOPB TI SOT-23-5 New 详细