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  • MSP430F5514IRGCR

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : MSP430F5xx
    Part Status : Active
    Core Processor : CPUXV2
    Core Size : 16-Bit
    Speed : 25MHz
    Connectivity : I2C, IrDA, LINbus, SCI, SPI, UART/USART, USB
    Peripherals : Brown-out Detect/Reset, DMA, POR, PWM, WDT
    Number of I/O : 47
    Program Memory Size : 64KB (64K x 8)
    Program Memory Type : FLASH
    RAM Size : 6K x 8
    Voltage - Supply (Vcc/Vdd) : 1.8V ~ 3.6V
    Oscillator Type : Internal
    Operating Temperature : -40°C ~ 85°C (TA)
    Mounting Type : Surface Mount
    Package / Case : 64-VFQFN Exposed Pad
    Supplier Device Package : 64-VQFN (9x9)

极速报价

型号
品牌 封装 批号 查看
CD74HCT03E TI 14-PDIP New 详细
TLC074CD TI 14-SOIC New 详细
PGA2311U/1K TI 16-SOIC New 详细
LMH0024MAE TI 16-SOIC New 详细
CDC421A212RGET TI 24-VQFN (4x4) New 详细
LM2903DG4 TI 8-SOIC New 详细
TPS62801YKAT TI 6-DSBGA (1.05x0.70) New 详细
LM5000SD-3 TI 16-WSON (5x5) New 详细
LP3990SDX-1.2/NOPB TI 6-WSON (3x3) New 详细
MSP430G2453IPW20R TI 20-TSSOP New 详细
ADS5553IPFP TI 80-HTQFP (12x12) New 详细
UCC28019AP TI 8-PDIP New 详细
TLC1542QFN TI 20-PLCC (9x9) New 详细
PCA9545APWT TI 20-TSSOP New 详细
TLV271IP TI 8-PDIP New 详细
TLC274IDR TI 14-SOIC New 详细
RI-I11-112A-03 TI New 详细
LM3S2939-IBZ50-A2 TI 108-BGA (10x10) New 详细
TMS320C6414TBCLZ7 TI 532-FC/CSP (23x23) New 详细
LP3874ES-ADJ TI DDPAK/TO-263-5 New 详细