产品系列

罗斌森
  • MSP430F5514IRGCT

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : MSP430F5xx
    Part Status : Active
    Core Processor : CPUXV2
    Core Size : 16-Bit
    Speed : 25MHz
    Connectivity : I2C, IrDA, LINbus, SCI, SPI, UART/USART, USB
    Peripherals : Brown-out Detect/Reset, DMA, POR, PWM, WDT
    Number of I/O : 47
    Program Memory Size : 64KB (64K x 8)
    Program Memory Type : FLASH
    RAM Size : 6K x 8
    Voltage - Supply (Vcc/Vdd) : 1.8V ~ 3.6V
    Oscillator Type : Internal
    Operating Temperature : -40°C ~ 85°C (TA)
    Mounting Type : Surface Mount
    Package / Case : 64-VFQFN Exposed Pad
    Supplier Device Package : 64-VQFN (9x9)

极速报价

型号
品牌 封装 批号 查看
TPS54616PWP TI 28-HTSSOP New 详细
SN74LVC8T245DBR TI 24-SSOP New 详细
LMV824DGVR TI 14-TVSOP New 详细
CLC5902VLA TI 128-PQFP (14x20) New 详细
LM3S5651-IQC80-C0T TI 100-LQFP (14x14) New 详细
LMH6714MA/NOPB TI 8-SOIC New 详细
CD74HC151M96 TI 16-SOIC New 详细
SN65LVDS307ZQCR TI 48-BGA MICROSTAR JUNIOR (4x4) New 详细
TMS320C5504AZCHA10 TI 196-NFBGA (10x10) New 详细
SN74LVC1G99QDCURQ1 TI US8 New 详细
TPS3613-01DGS TI 10-VSSOP New 详细
TPS2421-2DDAR TI 8-SO PowerPad New 详细
LM2832YSD EVAL TI New 详细
DAC8531IDRBT TI 8-SON-EP (3x3) New 详细
TPS54388QRTERQ1 TI 16-WQFN (3x3) New 详细
BQ2084DBT-V143 TI 38-TSSOP New 详细
TPA6111A2DGN TI 8-MSOP-PowerPad New 详细
TPS25200DRVR TI 6-WSON (2x2) New 详细
LM3S300-EGZ25-C2 TI 48-VQFN (7x7) New 详细
LM2733YMF/NOPB TI SOT-23-5 New 详细