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  • MSP430F5522IRGCT

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : MSP430F5xx
    Part Status : Active
    Core Processor : CPUXV2
    Core Size : 16-Bit
    Speed : 25MHz
    Connectivity : I2C, IrDA, LINbus, SCI, SPI, UART/USART, USB
    Peripherals : Brown-out Detect/Reset, DMA, POR, PWM, WDT
    Number of I/O : 47
    Program Memory Size : 32KB (32K x 8)
    Program Memory Type : FLASH
    RAM Size : 10K x 8
    Voltage - Supply (Vcc/Vdd) : 1.8V ~ 3.6V
    Data Converters : A/D 12x12b
    Oscillator Type : Internal
    Operating Temperature : -40°C ~ 85°C (TA)
    Mounting Type : Surface Mount
    Package / Case : 64-VFQFN Exposed Pad
    Supplier Device Package : 64-VQFN (9x9)

极速报价

型号
品牌 封装 批号 查看
TPS43332EVM TI New 详细
UC3842N TI 8-PDIP New 详细
CC2511F8RSPRG3 TI 36-VQFN (6x6) New 详细
TPS73150DBVT TI SOT-23-5 New 详细
BQ24014DRCR TI 10-VSON (3x3) New 详细
AM4376BZDND30 TI 491-NFBGA (17x17) New 详细
LM6154BCM TI 14-SOIC New 详细
LMR14050SEVM TI New 详细
LM46002QPWPRQ1 TI 16-HTSSOP New 详细
BQ24257YFFR TI 30-DSBGA New 详细
TRS3237EIDWG4 TI 28-SOIC New 详细
BQ28Z610EVM-532 TI New 详细
CD74HCT40103MT TI 16-SOIC New 详细
SN65HVD1474DR TI 8-SOIC New 详细
TPS76428DBVR TI SOT-23-5 New 详细
ADS8509IDW TI 20-SOIC New 详细
CD74HC4316M96 TI 16-SOIC New 详细
SN74LVTH2245DBR TI 20-SSOP New 详细
LM3S9D90-IBZ80-A2 TI 108-BGA (10x10) New 详细
SN74LV32APWT TI 14-TSSOP New 详细