产品系列

罗斌森
  • MSP430F5524IRGCT

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : MSP430F5xx
    Part Status : Active
    Core Processor : CPUXV2
    Core Size : 16-Bit
    Speed : 25MHz
    Connectivity : I2C, IrDA, LINbus, SCI, SPI, UART/USART, USB
    Peripherals : Brown-out Detect/Reset, DMA, POR, PWM, WDT
    Number of I/O : 47
    Program Memory Size : 64KB (64K x 8)
    Program Memory Type : FLASH
    RAM Size : 6K x 8
    Voltage - Supply (Vcc/Vdd) : 1.8V ~ 3.6V
    Data Converters : A/D 12x12b
    Oscillator Type : Internal
    Operating Temperature : -40°C ~ 85°C (TA)
    Mounting Type : Surface Mount
    Package / Case : 64-VFQFN Exposed Pad
    Supplier Device Package : 64-VQFN (9x9)

极速报价

型号
品牌 封装 批号 查看
LMS1587IS-3.3/NOPB TI DDPAK/TO-263-3 New 详细
PDRV5053RAQLPG TI TO-92-3 New 详细
LMC6482IM TI 8-SOIC New 详细
BQ298000RUGT TI 8-X2QFN (1.5x1.5) New 详细
DS80PCI800EVK/NOPB TI New 详细
TPS3850H18DRCT TI 10-VSON (3x3) New 详细
LM25085QMYE/NOPB TI 8-MSOP-EP New 详细
SN74LV132APWR TI 14-TSSOP New 详细
CY74FCT374CTQCT TI New 详细
CD4035BM TI 16-SOIC New 详细
LM25061PMME-1/NOPB TI 10-VSSOP New 详细
SN74AHCT374DWR TI New 详细
CD4060BM TI 16-SOIC New 详细
X66AK2H06XAAW2 TI 1517-FCBGA (40x40) New 详细
ADC0820CCWMX/NOPB TI 20-SOIC New 详细
TMP814PWR TI 20-TSSOP New 详细
TRSF23243IDGGRG4 TI 48-TSSOP New 详细
TNETV2685FIBZUT5 TI 529-FCBGA (19x19) New 详细
LM2587S-5.0/NOPB TI DDPAK/TO-263-5 New 详细
LM3S1751-IQC50-A2 TI 100-LQFP (14x14) New 详细