产品系列

罗斌森
  • MSP430F5634IZQWT

  • Manufacturer : Texas Instruments
    Packaging : Tape & Reel (TR)
    Alternate Packaging
    Series : MSP430F5xx
    Part Status : Not For New Designs
    Core Processor : CPUXV2
    Core Size : 16-Bit
    Speed : 20MHz
    Connectivity : I2C, IrDA, LINbus, SCI, SPI, UART/USART, USB
    Peripherals : Brown-out Detect/Reset, DMA, POR, PWM, WDT
    Number of I/O : 74
    Program Memory Size : 192KB (192K x 8)
    Program Memory Type : FLASH
    RAM Size : 18K x 8
    Voltage - Supply (Vcc/Vdd) : 1.8V ~ 3.6V
    Data Converters : A/D 16x12b
    Oscillator Type : Internal
    Operating Temperature : -40°C ~ 85°C (TA)
    Mounting Type : Surface Mount
    Package / Case : 113-VFBGA
    Supplier Device Package : 113-BGA Microstar Junior (7x7)

极速报价

型号
品牌 封装 批号 查看
OPT8241-CDK-EVM TI New 详细
TLC372QD TI 8-SOIC New 详细
OPA191IDGKT TI 8-VSSOP New 详细
LM5039EVAL/NOPB TI New 详细
TL432AIDBVR TI SOT-23-5 New 详细
OPAMPEVM-SOIC TI New 详细
TLV9001IDCKR TI SC-70-5 New 详细
SN74LV32AD TI 14-SOIC New 详细
DS90LV027MX TI 8-SOIC New 详细
SN74LV157APWR TI 16-TSSOP New 详细
CD74AC163M96 TI 16-SOIC New 详细
78HT233HC TI New 详细
CC3220MODSF12MOBR TI New 详细
TS5A3159DCKRE4 TI SC-70-6 New 详细
OPA2170AQDGKRQ1 TI 8-VSSOP New 详细
TPA6010A4PWPR TI 28-HTSSOP New 详细
LP3986TL-3133/NOPB TI 8-DSBGA (1.56x1.56) New 详细
SN65HVD230MDREP TI 8-SOIC New 详细
LP3855ESX-1.8 TI DDPAK/TO-263-5 New 详细
LMP2011MAX TI 8-SOIC New 详细