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  • MSP430F5636IPZ

  • Manufacturer : Texas Instruments
    Packaging : Tray
    Alternate Packaging
    Series : MSP430F5xx
    Part Status : Active
    Core Processor : CPUXV2
    Core Size : 16-Bit
    Speed : 20MHz
    Connectivity : I2C, IrDA, LINbus, SCI, SPI, UART/USART, USB
    Peripherals : Brown-out Detect/Reset, DMA, POR, PWM, WDT
    Number of I/O : 74
    Program Memory Size : 128KB (128K x 8)
    Program Memory Type : FLASH
    RAM Size : 18K x 8
    Voltage - Supply (Vcc/Vdd) : 1.8V ~ 3.6V
    Data Converters : A/D 16x12b; D/A 2x12b
    Oscillator Type : Internal
    Operating Temperature : -40°C ~ 85°C (TA)
    Mounting Type : Surface Mount
    Package / Case : 100-LQFP
    Supplier Device Package : 100-LQFP (14x14)

极速报价

型号
品牌 封装 批号 查看
TPA6020A2RGWR TI 20-VQFN (5x5) New 详细
SN74ABT833NT TI 24-PDIP New 详细
DAC7654YBTG4 TI 64-LQFP (10x10) New 详细
TL750L05CLP TI TO-92-3 New 详细
TMS320F2812PGFA TI 176-LQFP (24x24) New 详细
MSP430F5257IZQER TI 80-BGA MICROSTAR JUNIOR (5x5) New 详细
SN64BCT757NG4 TI 20-PDIP New 详细
TL1451ACPWR TI 16-TSSOP New 详细
BQ2057TS TI 8-TSSOP New 详细
74ACT16652DL TI 56-SSOP New 详细
LM2619ATL/NOPB TI 10-TμSMD (2.25x2.5) New 详细
SN74ALS2541DWR TI 20-SOIC New 详细
CC1350F128RHBT TI New 详细
ADC3244EVM TI New 详细
MSP430F5419AIZQWR TI 113-BGA Microstar Junior (7x7) New 详细
LMK61PD0A2-SIAT TI New 详细
LP5900SDX-3.3/NOPB TI 6-WSON (2.2x2.5) New 详细
LM335AMX/NOPB TI 8-SOIC New 详细
LP3876ES-2.5/NOPB TI DDPAK/TO-263-5 New 详细
UC2845AQD8 TI 8-SOIC New 详细