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  • MSP430FG4619IPZ

  • Manufacturer : Texas Instruments
    Packaging : Tray
    Alternate Packaging
    Series : MSP430x4xx
    Part Status : Active
    Core Processor : CPUX
    Core Size : 16-Bit
    Speed : 8MHz
    Connectivity : I2C, IrDA, LINbus, SCI, SPI, UART/USART
    Peripherals : Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
    Number of I/O : 80
    Program Memory Size : 120KB (120K x 8 + 256B)
    Program Memory Type : FLASH
    RAM Size : 4K x 8
    Voltage - Supply (Vcc/Vdd) : 1.8V ~ 3.6V
    Data Converters : A/D 12x12b; D/A 2x12b
    Oscillator Type : Internal
    Operating Temperature : -40°C ~ 85°C (TA)
    Mounting Type : Surface Mount
    Package / Case : 100-LQFP
    Supplier Device Package : 100-LQFP (14x14)

极速报价

型号
品牌 封装 批号 查看
TMS5703135CPGEQQ1 TI 144-LQFP (20x20) New 详细
TLVH431AIDCKR TI SC-70-6 New 详细
BQ771815DPJT TI 8-WSON (3x4) New 详细
LM4050CIM3X-2.5 TI SOT-23-3 New 详细
TAS5026IPAG TI 64-TQFP (10x10) New 详细
TPS65055EVM-258 TI New 详细
TPS3307-33D TI 8-SOIC New 详细
CGS74CT2524M TI 8-SOIC New 详细
LM336D-2-5 TI 8-SOIC New 详细
TMS320DM6433ZDU7 TI 376-BGA (23x23) New 详细
LM48555TLX/NOPB TI 12-μSMD (1.46x1.97) New 详细
SN65LV1224DB TI 28-SSOP New 详细
SN74CBT3253CRGYR TI 16-VQFN (4x4) New 详细
TPA3123D2EVM TI New 详细
OPA313IDCKR TI SC-70-5 New 详细
LM2734ZSD/NOPB TI 6-WSON (3x3) New 详细
ADC10158CIWMX/NOPB TI 28-SOIC New 详细
LP3881ES-1.2 TI DDPAK/TO-263-5 New 详细
TMS320C6746BZCG4 TI 361-NFBGA (13x13) New 详细
DRV8303DCAR TI 48-HTSSOP New 详细