产品系列

罗斌森
  • MSP430F6438IZQWR

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : MSP430F6xx
    Part Status : Active
    Core Processor : CPUXV2
    Core Size : 16-Bit
    Speed : 20MHz
    Connectivity : I2C, IrDA, LINbus, SCI, SPI, UART/USART
    Peripherals : Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
    Number of I/O : 74
    Program Memory Size : 256KB (256K x 8)
    Program Memory Type : FLASH
    RAM Size : 18K x 8
    Voltage - Supply (Vcc/Vdd) : 1.8V ~ 3.6V
    Data Converters : A/D 16x12b; D/A 2x12b
    Oscillator Type : Internal
    Operating Temperature : -40°C ~ 85°C (TA)
    Mounting Type : Surface Mount
    Package / Case : 113-VFBGA
    Supplier Device Package : 113-BGA Microstar Junior (7x7)

极速报价

型号
品牌 封装 批号 查看
TLV2772MDG4 TI 8-SOIC New 详细
TLV5638QDRG4 TI 8-SOIC New 详细
TS3L100DR TI New 详细
PCA9306DCUTG4 TI 8-VSSOP New 详细
SN74LVC2G07DCKRG4 TI SC-70-6 New 详细
TUSB212QRWBTQ1 TI 12-X2QFN (1.6x1.6) New 详细
BQ76PL536ATPAPTQ1 TI 64-HTQFP (10x10) New 详细
TRSF3223ECDBR TI 20-SSOP New 详细
TL4050B50IDCKT TI SC-70-5 New 详细
LM4050BIM3X-2.5/NOPB TI SOT-23-3 New 详细
SN74ALVC08IDREP TI 14-SOIC New 详细
SN74AC86DR TI 14-SOIC New 详细
CD4093BPW TI 14-TSSOP New 详细
TLV4110ID TI 8-SOIC New 详细
CSD23202W10T TI 4-DSBGA (1x1) New 详细
LP3855EMP-5.0/NOPB TI SOT-223-5 New 详细
TLV2783IN TI 14-PDIP New 详细
SN74LV04ARGYR TI 14-VQFN (3.5x3.5) New 详细
TL1963A-18DCQR TI SOT-223-6 New 详细
LP3892ES-1.5 TI DDPAK/TO-263-5 New 详细