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  • MSP430F6459TPZR

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : MSP430F6xx
    Part Status : Active
    Core Processor : CPUXV2
    Core Size : 16-Bit
    Speed : 20MHz
    Connectivity : I2C, IrDA, SCI, SPI, UART/USART
    Peripherals : Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
    Number of I/O : 74
    Program Memory Size : 512KB (512K x 8)
    Program Memory Type : FLASH
    RAM Size : 66K x 8
    Voltage - Supply (Vcc/Vdd) : 1.8V ~ 3.6V
    Data Converters : A/D 16x12b; D/A 2x12b
    Oscillator Type : Internal
    Operating Temperature : -40°C ~ 105°C (TA)
    Mounting Type : Surface Mount
    Package / Case : 100-LQFP
    Supplier Device Package : 100-LQFP (14x14)

极速报价

型号
品牌 封装 批号 查看
LP5900SD-1.8 TI 6-WSON (2.2x2.5) New 详细
LM3722EM5X-4.63 TI SOT-23-5 New 详细
SN74CBT3383CPWR TI 24-TSSOP New 详细
LMH0074SQX/NOPB TI 16-WQFN (4x4) New 详细
SN65HVD233SJD TI 8-CDIP New 详细
SN74LVC1G07DCKRE4 TI SC-70-5 New 详细
LM2574M-12/NOPB TI 14-SOIC New 详细
TLV70536YFMT TI 4-DSLGA New 详细
ADS8864IDRCR TI 10-VSON (3x3) New 详细
SN74CBTLV3383PWR TI 24-TSSOP New 详细
TLC2274CDR TI 14-SOIC New 详细
OPA2373AIDGST TI 10-VSSOP New 详细
BQ24616EVM TI New 详细
LM57BISDX-10/NOPB TI 8-WSON (3x3) New 详细
TPS2030IDRG4Q1 TI 8-SOIC New 详细
UC3705D TI 8-SOIC New 详细
LM5107MAX TI 8-SOIC New 详细
LP3876ES-1.8/NOPB TI DDPAK/TO-263-5 New 详细
UCC3957M-3G4 TI 16-SSOP New 详细
CD74HCT166E TI 16-PDIP New 详细