产品系列
MSP430F6634IZQWR
- Manufacturer : Texas Instruments
Packaging : Cut Tape (CT)
Alternate Packaging
Series : MSP430F6xx
Part Status : Active
Core Processor : CPUXV2
Core Size : 16-Bit
Speed : 20MHz
Connectivity : I2C, IrDA, LINbus, SCI, SPI, UART/USART, USB
Peripherals : Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O : 74
Program Memory Size : 192KB (192K x 8)
Program Memory Type : FLASH
RAM Size : 18K x 8
Voltage - Supply (Vcc/Vdd) : 1.8V ~ 3.6V
Data Converters : A/D 16x12b
Oscillator Type : Internal
Operating Temperature : -40°C ~ 85°C (TA)
Mounting Type : Surface Mount
Package / Case : 113-VFBGA
Supplier Device Package : 113-BGA Microstar Junior (7x7)
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| SN74LVTH162541DGGR | TI | 48-TSSOP | New | 详细 | |
| TPS54361DPRT | TI | 10-WSON (4x4) | New | 详细 | |
| SN74HC02QPWREP | TI | 14-TSSOP | New | 详细 | |
| LP3964ET-2.5 | TI | TO-220-5 | New | 详细 | |
| LM3S5791-IQC80-C5 | TI | 100-LQFP (14x14) | New | 详细 | |
| LMV712Q1MMX/NOPB | TI | 10-VSSOP | New | 详细 | |
| LM2936MMX-5.0 | TI | 8-VSSOP | New | 详细 | |
| SN74ABT7820-20PN | TI | 80-LQFP (12x12) | New | 详细 | |
| CLVC1G374QDBVRQ1 | TI | New | 详细 | ||
| LP3966ES-2.5/NOPB | TI | DDPAK/TO-263-5 | New | 详细 | |
| TLV3011AIDBVT | TI | SOT-23-6 | New | 详细 | |
| PCM1801U/2KG4 | TI | 14-SOIC | New | 详细 | |
| LM1851MX | TI | 8-SOIC | New | 详细 | |
| ISO7321CQDRQ1 | TI | 8-SOIC | New | 详细 | |
| LM1086ILDX-5.0/NOPB | TI | 8-WSON (4x4) | New | 详细 | |
| TLV2262AQPWRQ1 | TI | 8-TSSOP | New | 详细 | |
| LMP2014MTX | TI | 14-TSSOP | New | 详细 | |
| LM2852YMXAX-3.3/NOPB | TI | 14-HTSSOP | New | 详细 | |
| ADS8482IRGZR | TI | 48-VQFN (7x7) | New | 详细 | |
| TPS2553DRVT-1 | TI | 6-WSON (2x2) | New | 详细 |
请把您的采购需求告诉我们！
Copyright © 2007-2021 All Rights Reserved. - 深圳市罗斌森电子科技有限公司
E-MAIL: 2500045293@QQ.COM
备案号粤ICP备2021120841号
E-MAIL: 2500045293@QQ.COM
备案号粤ICP备2021120841号
网站设计webdesign www.wzdzkf.com