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  • MSP430FG4260IDLR

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : MSP430x4xx
    Part Status : Active
    Core Processor : MSP430
    Core Size : 16-Bit
    Speed : 8MHz
    Peripherals : Brown-out Detect/Reset, LCD, POR, PWM, WDT
    Number of I/O : 32
    Program Memory Size : 24KB (24K x 8 + 256B)
    Program Memory Type : FLASH
    RAM Size : 256 x 8
    Voltage - Supply (Vcc/Vdd) : 1.8V ~ 3.6V
    Data Converters : A/D 5x16b; D/A 1x12b
    Oscillator Type : Internal
    Operating Temperature : -40°C ~ 85°C (TA)
    Mounting Type : Surface Mount
    Package / Case : 48-BSSOP (0.295", 7.50mm Width)
    Supplier Device Package : 48-SSOP

极速报价

型号
品牌 封装 批号 查看
LP3883ESX-1.2 TI DDPAK/TO-263-5 New 详细
LMH0318RTWT TI 24-WQFN (4x4) New 详细
LM2841XQMK/NOPB TI TSOT-23-6 New 详细
TPS61200DRCT TI 10-VSON (3x3) New 详细
DS90LV027ATMX/NOPB TI 8-SOIC New 详细
BQ2022ALPR TI TO-92-3 New 详细
TLV2543IN TI 20-PDIP New 详细
LM2901PWR TI 14-TSSOP New 详细
SN74HC368DR TI 16-SOIC New 详细
LP3999ITL-1875/NOPB TI 5-DSBGA (1.41x1.08) New 详细
TMS320F28335PTPQ TI 176-HLQFP (24x24) New 详细
DAC7614P TI 16-PDIP New 详细
LM2675LD-5.0 TI 16-WSON (5x5) New 详细
LM79L05ACTL/NOPB TI 6-DSBGA (1.5x1.3) New 详细
AM26C31IPW TI 16-TSSOP New 详细
BQ76PL536TPAPTQ1 TI 64-HTQFP (10x10) New 详细
DS30BA101SQE/NOPB TI 16-WQFN (4x4) New 详细
LMV358Q1MMX/NOPB TI 8-VSSOP New 详细
TP13064BDW TI 20-SOIC New 详细
PGA460TPWQ1 TI 16-TSSOP New 详细