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  • MSP430G2153IRHB32T

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : MSP430G2xx
    Part Status : Active
    Core Processor : MSP430
    Core Size : 16-Bit
    Speed : 16MHz
    Connectivity : I2C, IrDA, LINbus, SCI, SPI, UART/USART
    Peripherals : Brown-out Detect/Reset, DMA, POR, PWM, WDT
    Number of I/O : 24
    Program Memory Size : 1KB (1K x 8)
    Program Memory Type : FLASH
    RAM Size : 256 x 8
    Voltage - Supply (Vcc/Vdd) : 1.8V ~ 3.6V
    Data Converters : A/D 8x10b
    Oscillator Type : Internal
    Operating Temperature : -40°C ~ 85°C (TA)
    Mounting Type : Surface Mount
    Package / Case : 32-VFQFN Exposed Pad
    Supplier Device Package : 32-VQFN (5x5)

极速报价

型号
品牌 封装 批号 查看
TPS54334DRCR TI 10-VSON (3x3) New 详细
TPS72750YFFR TI 4-DSBGA (1x1) New 详细
TPS3831K50DQNR TI 4-X2SON (1x1) New 详细
TLV3702QDRQ1 TI 8-SOIC New 详细
LM306P TI 8-PDIP New 详细
PTH03030WAZ TI New 详细
LM2791LD-H/NOPB TI 10-WSON (3x3) New 详细
LP5996SDX-1525 TI 10-SON (3x3) New 详细
LM4040A41IDBZR TI SOT-23-3 New 详细
TPS4H000EVM TI New 详细
LM4911MM TI 10-VSSOP New 详细
TLV705285YFPR TI 4-DSBGA (0.8x0.8) New 详细
UCD3020ARGZR TI 48-VQFN (7x7) New 详细
SN74AHC373N TI 20-PDIP New 详细
LM4040AIM3X-5.0 TI SOT-23-3 New 详细
INA180B4IDBVT TI SOT-23-5 New 详细
CD74HCT423M96 TI 16-SOIC New 详细
TPS73719QDRBRQ1 TI 8-SON (3x3) New 详细
TLV61224DCKT TI SC-70-6 New 详细
XAM5728BABCXE TI 760-FCBGA (23x23) New 详细