产品系列

罗斌森
  • MSP430G2332IPW20R

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : MSP430G2xx
    Part Status : Active
    Core Processor : MSP430
    Core Size : 16-Bit
    Speed : 16MHz
    Connectivity : I2C, SPI, USI
    Peripherals : Brown-out Detect/Reset, DMA, POR, PWM, WDT
    Number of I/O : 16
    Program Memory Size : 4KB (4K x 8)
    Program Memory Type : FLASH
    RAM Size : 256 x 8
    Voltage - Supply (Vcc/Vdd) : 1.8V ~ 3.6V
    Data Converters : A/D 8x10b
    Oscillator Type : Internal
    Operating Temperature : -40°C ~ 85°C (TA)
    Mounting Type : Surface Mount
    Package / Case : 20-TSSOP (0.173", 4.40mm Width)
    Supplier Device Package : 20-TSSOP

极速报价

型号
品牌 封装 批号 查看
CSD95378BQ5MCT TI 12-VSON (5x6) New 详细
SM72485E/NOPB TI 8-WSON (4x4) New 详细
TMDXEVM388 TI New 详细
LM25101CMAX/NOPB TI New 详细
SN75159D TI 14-SOIC New 详细
TLC274MDRG4 TI 14-SOIC New 详细
XAM5728BABCXE TI 760-FCBGA (23x23) New 详细
LMP7718MM/NOPB TI 8-VSSOP New 详细
SN7407D TI 14-SOIC New 详细
LMV358QDR TI 8-SOIC New 详细
TLC271CPWR TI 8-TSSOP New 详细
SN65LVPE512RGER TI 24-VQFN (4x4) New 详细
LMC6482AIN TI 8-PDIP New 详细
SN74LVTH652DW TI 24-SOIC New 详细
CC3200MODR1M2AMOBR TI New 详细
INA216A3YFFR TI 4-DSBGA (1x1) New 详细
TLE2072IDR TI 8-SOIC New 详细
MSP430F6659IZQWR TI 113-BGA Microstar Junior (7x7) New 详细
LM2748MTC TI 14-TSSOP New 详细
SN55HVD75DRBREP TI 8-SON (3x3) New 详细