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MSP430G2353IN20
- Manufacturer : Texas Instruments
Packaging : Tube
Series : MSP430G2xx
Part Status : Active
Core Processor : MSP430
Core Size : 16-Bit
Speed : 16MHz
Connectivity : I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals : Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O : 16
Program Memory Size : 4KB (4K x 8)
Program Memory Type : FLASH
RAM Size : 256 x 8
Voltage - Supply (Vcc/Vdd) : 1.8V ~ 3.6V
Data Converters : A/D 8x10b
Oscillator Type : Internal
Operating Temperature : -40°C ~ 85°C (TA)
Mounting Type : Through Hole
Package / Case : 20-DIP (0.300", 7.62mm)
Supplier Device Package : 20-PDIP
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| ISO7762FDBQR | TI | 16-SSOP | New | 详细 | |
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| LMR14206XMKDEMO/NOPB | TI | New | 详细 | ||
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| INA2133U/2K5G4 | TI | 14-SOIC | New | 详细 | |
| SN74LS47DR | TI | 16-SOIC | New | 详细 | |
| LM3404FSTDIMEV/NOPB | TI | New | 详细 | ||
| LMV824QPWRQ1 | TI | 14-TSSOP | New | 详细 | |
| TSS721ADR | TI | 16-SOIC | New | 详细 | |
| BQ77908AEVM-001 | TI | New | 详细 | ||
| SN74LVC1G14YZAR | TI | 5-DSBGA, 5-WCSP (1.4x0.9) | New | 详细 | |
| LM2575HVS-3.3 | TI | DDPAK/TO-263-5 | New | 详细 | |
| TLC5947DAP | TI | 32-HTSSOP | New | 详细 | |
| LMX2434TMX | TI | 20-TSSOP | New | 详细 | |
| LM21215EVM/NOPB | TI | New | 详细 | ||
| PCM2900CDB | TI | 28-SSOP | New | 详细 | |
| SN74ALVTH16827VR | TI | 56-TVSOP | New | 详细 |
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