产品系列

罗斌森
  • MSP430G2402IPW20R

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : MSP430G2xx
    Part Status : Active
    Core Processor : MSP430
    Core Size : 16-Bit
    Speed : 16MHz
    Connectivity : I2C, SPI, USI
    Peripherals : Brown-out Detect/Reset, DMA, POR, PWM, WDT
    Number of I/O : 16
    Program Memory Size : 8KB (8K x 8)
    Program Memory Type : FLASH
    RAM Size : 256 x 8
    Voltage - Supply (Vcc/Vdd) : 1.8V ~ 3.6V
    Oscillator Type : Internal
    Operating Temperature : -40°C ~ 85°C (TA)
    Mounting Type : Surface Mount
    Package / Case : 20-TSSOP (0.173", 4.40mm Width)
    Supplier Device Package : 20-TSSOP

极速报价

型号
品牌 封装 批号 查看
ADC10D1500RB/NOPB TI New 详细
LMC6482IMX/NOPB TI 8-SOIC New 详细
LM3S9U92-IQC80-A1 TI 100-LQFP (14x14) New 详细
LM224D TI 14-SOIC New 详细
TMS320C6746BZCG4 TI 361-NFBGA (13x13) New 详细
SN7406NG4 TI 14-PDIP New 详细
TLV2548QDWRG4 TI 20-SOIC New 详细
VCA2615EVM TI New 详细
CDC924DL TI 56-SSOP New 详细
TMS320F2810PBKA TI 128-LQFP (14x14) New 详细
LMH6521SQ/NOPB TI 32-WQFN (5x5) New 详细
TPS79630KTTTG3 TI DDPAK/TO-263-5 New 详细
TLV620612TDSGRQ1 TI 8-WSON (2x2) New 详细
SN74LS399DE4 TI 16-SOIC New 详细
PT6882A TI New 详细
CD4504BPW TI 16-TSSOP New 详细
LM3S6537-EQC50-A2T TI 100-LQFP (14x14) New 详细
UCC38083D TI 8-SOIC New 详细
DAC8163SDSCR TI 10-WSON (3x3) New 详细
TLC556IN TI 14-PDIP New 详细