产品系列

罗斌森
  • MSP430FG477IZQWR

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : MSP430x4xx
    Part Status : Active
    Core Processor : MSP430
    Core Size : 16-Bit
    Speed : 8MHz
    Connectivity : I2C, IrDA, LINbus, SCI, SPI, UART/USART
    Peripherals : Brown-out Detect/Reset, LCD, PWM, WDT
    Number of I/O : 48
    Program Memory Size : 32KB (32K x 8 + 256B)
    Program Memory Type : FLASH
    RAM Size : 2K x 8
    Voltage - Supply (Vcc/Vdd) : 1.8V ~ 3.6V
    Data Converters : A/D 5x16b; D/A 2x12b
    Oscillator Type : Internal
    Operating Temperature : -40°C ~ 85°C (TA)
    Mounting Type : Surface Mount
    Package / Case : 113-VFBGA
    Supplier Device Package : 113-BGA Microstar Junior (7x7)

极速报价

型号
品牌 封装 批号 查看
ONET1101LRGER TI 24-VQFN (4x4) New 详细
OPA2704UA/2K5 TI 8-SOIC New 详细
PGA411QPAPRQ1 TI 64-HTQFP (14x14) New 详细
REG113NA-2.5/250 TI SOT-23-5 New 详细
SN74LVC244ADGVR TI 20-TVSOP New 详细
SN74AUC2GU04DBVR TI SOT-23-6 New 详细
LM5110-1SD/NOPB TI 10-WSON (4x4) New 详细
LM2670SD-3.3 TI 14-VSON (5x6) New 详细
TRF3761-DIRHAR TI 40-VQFN (6x6) New 详细
CD74ACT164M96 TI 14-SOIC New 详细
REF5040AIDR TI 8-SOIC New 详细
LM2670S-3.3 TI DDPAK/TO-263-7 New 详细
LM3354MM-3.7/NOPB TI 10-VSSOP New 详细
TMS32C6415EGLZA5E0 TI 532-FCBGA (23x23) New 详细
TPS3705-50DGNR TI 8-MSOP-PowerPad New 详细
SN74HC563DW TI 20-SOIC New 详细
BQ4011YMA-100 TI 28-DIP Module (18.42x37.72) New 详细
TPS51716RUKT TI 20-WQFN (3x3) New 详细
LM3S5G51-IBZ80-A1T TI 108-BGA (10x10) New 详细
SN74S157NSRE4 TI 16-SO New 详细