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  • MSP430G2433IPW28

  • Manufacturer : Texas Instruments
    Packaging : Tube
    Alternate Packaging
    Series : MSP430G2xx
    Part Status : Active
    Core Processor : MSP430
    Core Size : 16-Bit
    Speed : 16MHz
    Connectivity : I2C, IrDA, LINbus, SCI, SPI, UART/USART
    Peripherals : Brown-out Detect/Reset, PWM, WDT
    Number of I/O : 24
    Program Memory Size : 8KB (8K x 8)
    Program Memory Type : FLASH
    RAM Size : 512 x 8
    Voltage - Supply (Vcc/Vdd) : 1.8V ~ 3.6V
    Data Converters : A/D 8x10b
    Oscillator Type : Internal
    Operating Temperature : -40°C ~ 85°C (TA)
    Mounting Type : Surface Mount
    Package / Case : 28-TSSOP (0.173", 4.40mm Width)
    Supplier Device Package : 28-TSSOP

极速报价

型号
品牌 封装 批号 查看
SN74AC74MDREP TI New 详细
LM2679T-5.0/NOPB TI TO-220-7 New 详细
THS3062DR TI 8-SOIC New 详细
LM26480QSQX-AA/NOPB TI New 详细
TLV27L2QDRQ1 TI 8-SOIC New 详细
LM3710XKMM-463/NOPB TI 10-VSSOP New 详细
CDCE906PW TI 20-TSSOP New 详细
LM2936BM-5.0 TI 8-SOIC New 详细
CC2640R2FRGZR TI 48-VQFN (7x7) New 详细
TLV1117-33CDCYG3 TI SOT-223-4 New 详细
LM2941SX TI DDPAK/TO-263-5 New 详细
ADS1261BIRHBT TI 32-VQFN (5x5) New 详细
LM2751SD-B TI 10-WSON (3x3) New 详细
MSP430G2332IRSA16R TI 16-QFN (4x4) New 详细
TPS259230DRCR TI 10-VSON (3x3) New 详细
SN74LVCH8T245DWR TI 24-SOIC New 详细
LM22676MR-5.0/NOPB TI 8-SO PowerPad New 详细
LP5552TL/NOPB TI 36-μSMD (3.46x3.46) New 详细
TXB0101DBVT TI SOT-23-6 New 详细
LP3875ES-3.3 TI DDPAK/TO-263-5 New 详细