产品系列

罗斌森
  • MSP430G2453IPW28R

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : MSP430G2xx
    Part Status : Active
    Core Processor : MSP430
    Core Size : 16-Bit
    Speed : 16MHz
    Connectivity : I2C, IrDA, LINbus, SCI, SPI, UART/USART
    Peripherals : Brown-out Detect/Reset, DMA, POR, PWM, WDT
    Number of I/O : 24
    Program Memory Size : 8KB (8K x 8)
    Program Memory Type : FLASH
    RAM Size : 512 x 8
    Voltage - Supply (Vcc/Vdd) : 1.8V ~ 3.6V
    Data Converters : A/D 8x10b
    Oscillator Type : Internal
    Operating Temperature : -40°C ~ 85°C (TA)
    Mounting Type : Surface Mount
    Package / Case : 20-TSSOP (0.173", 4.40mm Width)
    Supplier Device Package : 28-TSSOP

极速报价

型号
品牌 封装 批号 查看
TLC393CDR TI 8-SOIC New 详细
LM75AIMX/NOPB TI 8-SOIC New 详细
TPS77815PWP TI 20-HTSSOP New 详细
UCC2813DTR-2 TI 8-SOIC New 详细
ISO7731FDBQ TI 16-SSOP New 详细
LMC6064IMX/NOPB TI 14-SOIC New 详细
X66AK2H06AAWA24 TI 1517-FCBGA (40x40) New 详细
TMS320LBC56PZ57 TI 100-LQFP (14x14) New 详细
LM3S2948-IBZ50-A2 TI 108-BGA (10x10) New 详细
BQ24257YFFT TI 30-DSBGA New 详细
TLV2782IDGKR TI 8-VSSOP New 详细
TLV75519PDRVR TI 6-WSON (2x2) New 详细
MSP430FR59691IRGZR TI 48-VQFN (7x7) New 详细
LM34DMX/NOPB TI 8-SOIC New 详细
TS3V340DR TI New 详细
SN74HC04NSR TI 14-SOP New 详细
TAS5122DFDRG4 TI 56-HTSSOP New 详细
TLV70230QDSERQ1 TI 6-WSON (1.5x1.5) New 详细
TPS61236RWLR TI 9-VQFN-HR (2.5x2.5) New 详细
TNETV2685VIDZUT9 TI 529-FCBGA (19x19) New 详细