产品系列

罗斌森
  • OMAPL138EZCEA3

  • Manufacturer : Texas Instruments
    Packaging : Tray
    Alternate Packaging
    Series : OMAP-L1x
    Part Status : Active
    Core Processor : ARM926EJ-S
    Number of Cores/Bus Width : 1 Core, 32-Bit
    Speed : 375MHz
    Co-Processors/DSP : Signal Processing; C674x, System Control; CP15
    RAM Controllers : SDRAM
    Graphics Acceleration : No
    Display & Interface Controllers : LCD
    Ethernet : 10/100 Mbps (1)
    SATA : SATA 3Gbps (1)
    USB : USB 1.1 + PHY (1), USB 2.0 + PHY (1)
    Voltage - I/O : 1.8V, 3.3V
    Operating Temperature : -40°C ~ 105°C (TJ)
    Security Features : Boot Security, Cryptography
    Package / Case : 361-LFBGA
    Supplier Device Package : 361-NFBGA (13x13)

极速报价

型号
品牌 封装 批号 查看
UCC2804DTR TI 8-SOIC New 详细
TSC2007EVM TI New 详细
CD74HCT368M96 TI 16-SOIC New 详细
CLVTH32374IGKEREP TI New 详细
UCC24610EVM-693 TI New 详细
TLV431BIDBVT TI SOT-23-5 New 详细
TS5A23160DGST TI 10-VSSOP New 详细
TPS3838E18DBVT TI SOT-23-5 New 详细
TPS40210DGQRG4 TI New 详细
TLV5633CPWRG4 TI 20-TSSOP New 详细
ADC08D1000CIYB TI 128-HLQFP (20x20) New 详细
INA216A1YFFR TI 4-DSBGA (0.76x0.76) New 详细
MSP430F2252TDA TI 38-TSSOP New 详细
SN74LVCC4245ADW TI 24-SOIC New 详细
UCC3974PW TI 16-TSSOP New 详细
BQ29707DSET TI 6-WSON (1.5x1.5) New 详细
LM7915CT/NOPB TI TO-220-3 New 详细
TPS40051PWPRG4 TI 16-HTSSOP New 详细
SN74LV125ANSR TI 14-SOP New 详细
SN74ABT373DWR TI 20-SOIC New 详细