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  • MSP430FR2310IRGYR

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : MSP430? FRAM
    Part Status : Active
    Core Processor : MSP430
    Core Size : 16-Bit
    Speed : 16MHz
    Connectivity : I2C, IrDA, SCI, SPI, UART/USART
    Peripherals : Brown-out Detect/Reset, POR, PWM, WDT
    Number of I/O : 12
    Program Memory Size : 3.75KB (3.75K x 8)
    Program Memory Type : FRAM
    RAM Size : 1K x 8
    Voltage - Supply (Vcc/Vdd) : 1.8V ~ 3.6V
    Data Converters : A/D 8x10b
    Oscillator Type : Internal
    Operating Temperature : -40°C ~ 85°C (TA)
    Mounting Type : Surface Mount
    Package / Case : 16-VFQFN Exposed Pad
    Supplier Device Package : 16-VQFN (4x3.5)

极速报价

型号
品牌 封装 批号 查看
TMS320F28035RSHT TI 56-VQFN (7x7) New 详细
LMV931MGX/NOPB TI SC-70-5 New 详细
SN74LVTH16652DL TI 56-SSOP New 详细
LM2575N-5.0/NOPB TI 16-DIP New 详细
TLC5615IDGKR TI 8-VSSOP New 详细
LMR23630AFQDDARQ1 TI 8-SO PowerPad New 详细
TPS62263TDRVRQ1 TI 6-SON (2x2) New 详细
ADS8329IRSAR TI 16-QFN (4x4) New 详细
LM2751SD-B TI 10-WSON (3x3) New 详细
TLV71125125DSER TI 6-WSON (1.5x1.5) New 详细
LM3409QHVMY/NOPB TI 10-MSOP-PowerPad New 详细
PCM1789PW TI 24-TSSOP New 详细
LM5022BSTBLDT/NOPB TI New 详细
LM78L12ACM TI 8-SOIC New 详细
BQ25017RHLR TI 20-VQFN (3.5x4.5) New 详细
TAS5631BDKDR TI 44-HSSOP New 详细
TLV2333IDGKT TI 8-VSSOP New 详细
LP3965ESX-5.0 TI DDPAK/TO-263-5 New 详细
LM2672M-12 TI 8-SOIC New 详细
LM3S2110-IBZ25-A2T TI 108-BGA (10x10) New 详细