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  • MSP430FR5730IRGER

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : MSP430? FRAM
    Part Status : Active
    Core Processor : CPUXV2
    Core Size : 16-Bit
    Speed : 24MHz
    Connectivity : I2C, IrDA, LINbus, SCI, SPI, UART/USART
    Peripherals : Brown-out Detect/Reset, POR, PWM, WDT
    Number of I/O : 17
    Program Memory Size : 4KB (4K x 8)
    Program Memory Type : FRAM
    RAM Size : 1K x 8
    Voltage - Supply (Vcc/Vdd) : 2V ~ 3.6V
    Data Converters : A/D 8x10b
    Oscillator Type : Internal
    Operating Temperature : -40°C ~ 85°C (TA)
    Mounting Type : Surface Mount
    Package / Case : 24-VFQFN Exposed Pad
    Supplier Device Package : 24-VQFN (4x4)

极速报价

型号
品牌 封装 批号 查看
TPIC6B596N TI 20-PDIP New 详细
UCC3882PWTR-1G4 TI 28-TSSOP New 详细
TPS2151IPWPR TI 14-HTSSOP New 详细
SN74ALS561ADWE4 TI 20-SOIC New 详细
LP38841T-0.8 TI TO-220-5 New 详细
BQ27421YZFT-G1D TI 9-DSBGA New 详细
LP2985AIBP-3.0 TI 5-μSMD (0.93x1.11) New 详细
PCM1861EVM TI New 详细
TPS3807A30DCKT TI SC-70-5 New 详细
THS4303EVM TI New 详细
SN65HVD20P TI 8-PDIP New 详细
LP38693QSDX-ADJ/NOPB TI 6-WSON (3x3) New 详细
LP5910-1.1BYKAT TI 4-DSBGA New 详细
CSD23201W10 TI 4-DSBGA (1x1) New 详细
SN74ABT623N TI 20-PDIP New 详细
UC3527BNG4 TI 16-PDIP New 详细
CDCVF25081PWR TI 16-TSSOP New 详细
TPS74901RGWR TI 20-VQFN (5x5) New 详细
ADC0802LCWM/NOPB TI 20-SOIC New 详细
LM3700XBBP-270 TI 9-μSMD (1.41x1.41) New 详细