产品系列

罗斌森
  • MSP430FR5867IRGZT

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : MSP430? FRAM
    Part Status : Active
    Core Processor : CPUXV2
    Core Size : 16-Bit
    Speed : 16MHz
    Connectivity : I2C, IrDA, SCI, SPI, UART/USART
    Peripherals : Brown-out Detect/Reset, DMA, POR, PWM, WDT
    Number of I/O : 40
    Program Memory Size : 32KB (32K x 8)
    Program Memory Type : FRAM
    RAM Size : 1K x 8
    Voltage - Supply (Vcc/Vdd) : 1.8V ~ 3.6V
    Data Converters : A/D 16x12b
    Oscillator Type : Internal
    Operating Temperature : -40°C ~ 85°C (TA)
    Mounting Type : Surface Mount
    Package / Case : 48-VFQFN Exposed Pad
    Supplier Device Package : 48-VQFN (7x7)

极速报价

型号
品牌 封装 批号 查看
L293DWPG4 TI 28-SOIC New 详细
TPS22958NEVM TI New 详细
TL1451CPWRG4 TI 16-TSSOP New 详细
TPS65218B1PHPT TI 48-HTQFP (7x7) New 详细
UCC27525DR TI 8-SOIC New 详细
DRV5053VAQDBZRQ1 TI SOT-23-3 New 详细
TLE2037QDRG4Q1 TI 8-SOIC New 详细
TPS22967DSGR TI 8-WSON (2x2) New 详细
BQ24079QWRGTTQ1 TI 16-VQFN (3x3) New 详细
SN74LVC3G07DCURE4 TI US8 New 详细
PCM2707PJTG4 TI 32-TQFP (7x7) New 详细
LM3S8C62-IBZ80-A2T TI 108-BGA (10x10) New 详细
SN74LV245ATNS TI 20-SO New 详细
LM26LVCISD-100/NOPB TI 6-WSON (2.2x2.5) New 详细
TL16C554AFN TI 68-PLCC (24.23x24.23) New 详细
SN74HC02NS TI New 详细
TPS7430D TI 8-SOIC New 详细
TLC274CN TI 14-PDIP New 详细
UCC27524A1QDGNRQ1 TI 8-MSOP New 详细
HDC2010YPAT TI 6-DSBGA New 详细