产品系列

罗斌森
  • MSP430FR5962IRGZR

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : MSP430? FRAM
    Part Status : Active
    Core Processor : CPUXV2
    Core Size : 16-Bit
    Speed : 16MHz
    Connectivity : I2C, IrDA, SPI, UART/USART
    Peripherals : Brown-out Detect/Reset, DMA, POR, PWM, WDT
    Number of I/O : 40
    Program Memory Size : 128KB (128K x 8)
    Program Memory Type : FRAM
    RAM Size : 8K x 8
    Voltage - Supply (Vcc/Vdd) : 1.8V ~ 3.6V
    Data Converters : A/D 16x12b
    Oscillator Type : Internal/External
    Operating Temperature : -40°C ~ 85°C (TA)
    Mounting Type : Surface Mount
    Package / Case : 48-VFQFN Exposed Pad
    Supplier Device Package : 48-VQFN (7x7)

极速报价

型号
品牌 封装 批号 查看
SN74AHC1G02DBVT TI SOT-23-5 New 详细
LMH6504MMX TI 8-VSSOP New 详细
REF02BU TI 8-SOIC New 详细
CD74HC123M96 TI 16-SOIC New 详细
SN74LVTH374PWR TI New 详细
DAC7642VFRG4 TI 32-LQFP (7x7) New 详细
COP438CN TI 20-DIP New 详细
LP3985IBL-5.0 TI 5-DSBGA (1.41x1.08) New 详细
SN65HVD1471DGKR TI 8-VSSOP New 详细
UCD9244RGCT TI 64-VQFN (9x9) New 详细
LMV721M5/NOPB TI SOT-23-5 New 详细
TPD4E05U06DQAR TI 10-USON (2.5x1) New 详细
TPS78227DDCT TI SOT-23-5 New 详细
THS6093CDRG4 TI 14-SOIC New 详细
TLC3545IDGKR TI 8-VSSOP New 详细
MSP430FR5728IRGER TI 24-VQFN (4x4) New 详细
THS4052CDGNR TI 8-MSOP-PowerPad New 详细
CC1310F32RSMR TI New 详细
LM2675M-5.0/NOPB TI 8-SOIC New 详细
LM2674N-12 TI 8-PDIP New 详细