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罗斌森
  • RF430CL330HIRGTR

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : *
    Part Status : Active
    Package / Case : 16-VFQFN Exposed Pad
    Supplier Device Package : 16-VQFN (3x3)

极速报价

型号
品牌 封装 批号 查看
LP3874EMPX-2.5 TI SOT-223-5 New 详细
TPD1E01B04DPLT TI 2-X2SON (0.6x0.3) New 详细
AM1806BZWT3 TI 361-NFBGA (13x13) New 详细
SN74LVCH8T245DGVR TI 24-TVSOP New 详细
LM3241TLX/NOPB TI 6-DSBGA (1.5x1.3) New 详细
LMZ31503EVM-692 TI New 详细
MF10CCWMX TI 20-SOIC New 详细
TSB43CA42PGF TI 176-LQFP (24x24) New 详细
MAX208CDW TI 24-SOIC New 详细
SN74LV4053ARGYR TI 16-VQFN (4x4) New 详细
TLC272BCP TI 8-PDIP New 详细
LM556CN/NOPB TI 14-DIP New 详细
TPS7A3721EVM-529 TI New 详细
DS90UB933TRTVRQ1 TI 32-WQFN (5x5) New 详细
TMDSPLCKITV4-ARIB TI New 详细
OPA228U TI 8-SOIC New 详细
LM431ACM3X TI SOT-23-3 New 详细
TPS563209EVM-652 TI New 详细
SN74AS652DWRG4 TI 24-SOIC New 详细
SN74HC4020DT TI 16-SOIC New 详细