产品系列
产品系列
MSP-EXP430G2ET
- Manufacturer : Texas Instruments
Series : MSP430G2
Part Status : Active
Board Type : Evaluation Platform
Type : MCU 16-Bit
Core Processor : MSP430
Platform : LaunchPad?
Utilized IC / Part : MSP430G2553
Mounting Type : Fixed
Contents : Board(s)
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| DAC7611U | TI | 8-SOIC | New | 详细 | |
| LM22670MRE-5.0/NOPB | TI | 8-SO PowerPad | New | 详细 | |
| CD74ACT652M96 | TI | 24-SOIC | New | 详细 | |
| CC2560BYFVR | TI | New | 详细 | ||
| SN10KHT5543NT | TI | 24-PDIP | New | 详细 | |
| VSP5010PMRG6 | TI | 64-LQFP (10x10) | New | 详细 | |
| TMS320C6720BRFP200 | TI | 144-HTQFP (20x20) | New | 详细 | |
| SN64BCT244DWR | TI | 20-SOIC | New | 详细 | |
| TLV2217-18KTPR | TI | 2-PowerFLEX? | New | 详细 | |
| LM4040BIZ-3.0/NOPB | TI | TO-92-3 | New | 详细 | |
| TPS61236PRWLR | TI | 9-VQFN-HR (2.5x2.5) | New | 详细 | |
| ADC122S021CIMMX | TI | 8-VSSOP | New | 详细 | |
| CD74HC4052PW | TI | 16-TSSOP | New | 详细 | |
| LP3966ES-1.8 | TI | DDPAK/TO-263-5 | New | 详细 | |
| CD74HCT373M96 | TI | 20-SOIC | New | 详细 | |
| CD74HC541PW | TI | 20-TSSOP | New | 详细 | |
| LP2988ILD-5.0 | TI | 8-WSON (4x4) | New | 详细 | |
| TM4C123FH6PMI | TI | 64-LQFP (10x10) | New | 详细 | |
| CD4527BNSR | TI | 16-SO | New | 详细 | |
| LM723CN/NOPB | TI | 14-DIP | New | 详细 |
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