罗斌森
  • SN74AUC2G66YZPR

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Part Status : Active
    Switch Circuit : SPST - NO
    Multiplexer/Demultiplexer Circuit : 1:1
    Number of Circuits : 2
    On-State Resistance (Max) : 15 Ohm
    Channel-to-Channel Matching (δRon) : 1 Ohm (Max)
    Voltage - Supply, Single (V+) : 0.8V ~ 2.7V
    Switch Time (Ton, Toff) (Max) : 2.3ns, 2ns
    -3db Bandwidth : 50MHz
    Channel Capacitance (CS(off), CD(off)) : 2.5pF
    Current - Leakage (IS(off)) (Max) : 1μA
    Crosstalk : -60dB @ 1MHz
    Operating Temperature : -40°C ~ 85°C (TA)
    Package / Case : 8-XFBGA, DSBGA
    Supplier Device Package : 8-DSBGA, 8-WCSP (1.9x0.9)

极速报价

型号
品牌 封装 批号 查看
MSP430F5438AIPZ TI 100-LQFP (14x14) New 详细
LM21212MHE-1/NOPB TI 20-HTSSOP New 详细
LP3913SQ-AD/NOPB TI 48-WQFN (6x6) New 详细
TUSB2046IBVFR TI 32-LQFP (7x7) New 详细
ADC081S051CISD TI 6-WSON (2.2x2.5) New 详细
TPS73132DBVT TI SOT-23-5 New 详细
TPS3828-50DBVT TI SOT-23-5 New 详细
PCA9534APWR TI 16-TSSOP New 详细
TLC555CDR TI 8-SOIC New 详细
TPIC6A595DW TI 24-SOIC New 详细
UC3710DW TI 16-SOIC New 详细
CD74HC367M TI 16-SOIC New 详细
ADS7056EVM-PDK TI New 详细
LMX2434EVAL/NOPB TI New 详细
OPA2227MDREP TI 8-SOIC New 详细
TPS62085EVM-169 TI New 详细
TPS3813L30DBVR TI SOT-23-6 New 详细
TLV5632IDW TI 20-SOIC New 详细
LP38693SD-2.5 TI 6-WSON (3x3) New 详细
ADC12DJ3200AAV TI 144-FCBGA (10x10) New 详细