罗斌森
  • SN74LVC1G332DSFR

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : 74LVC
    Part Status : Active
    Logic Type : OR Gate
    Number of Circuits : 1
    Number of Inputs : 3
    Voltage - Supply : 1.65V ~ 5.5V
    Current - Quiescent (Max) : 10μA
    Current - Output High, Low : 32mA, 32mA
    Logic Level - Low : 0.7V ~ 0.8V
    Logic Level - High : 1.7V ~ 2V
    Max Propagation Delay @ V, Max CL : 4.5ns @ 5V, 50pF
    Operating Temperature : -40°C ~ 125°C
    Mounting Type : Surface Mount
    Supplier Device Package : 6-SON (1x1)
    Package / Case : 6-XFDFN

极速报价

型号
品牌 封装 批号 查看
DMVA3AAAR TI 609-FCBGA (16x16) New 详细
TNETV1002IDZHK TI 257-BGA MICROSTAR (16x16) New 详细
LM2611BMF/NOPB TI SOT-23-5 New 详细
LMV331M7X/NOPB TI SC-70-5 New 详细
LM4132BMF-3.3 TI SOT-23-5 New 详细
SN74AUC2G53YEPR TI 8-DSBGA, 8-WCSP (1.9x0.9) New 详细
DP83815DVNG/NOPB TI 144-LQFP (20x20) New 详细
SN74HC08QDRQ1 TI 14-SOIC New 详细
FDC2214EVM TI New 详细
MSP430F2616TZQWR TI 113-BGA Microstar Junior (7x7) New 详细
LMH6733MQX/NOPB TI 16-SSOP New 详细
LMR16006XDDCR TI TSOT-23-6 New 详细
SM320F2812GHHMEP TI 179-BGA MicroStar (12x12) New 详细
SN74LVC1G32DCKRG4 TI SC-70-5 New 详细
TPS70802PWP TI 20-HTSSOP New 详细
LM3411AM5-5.0/NOPB TI SOT-23-5 New 详细
DRIVECABLE02EVK/NOPB TI New 详细
SN74LS623DWG4 TI 20-SOIC New 详细
LP3876ESX-2.5/NOPB TI DDPAK/TO-263-5 New 详细
LMZM23600V3SILT TI 10-uSIP (3.8x3) New 详细