产品系列
产品系列
TLV2170IDR
- Manufacturer : Texas Instruments
Packaging : Cut Tape (CT)
Alternate Packaging
Part Status : Active
Amplifier Type : General Purpose
Number of Circuits : 1
Output Type : Rail-to-Rail
Slew Rate : 0.4V/μs
Gain Bandwidth Product : 1.2MHz
Current - Input Bias : 10pA
Voltage - Input Offset : 500μV
Current - Supply : 125μA
Current - Output / Channel : 17mA
Voltage - Supply, Single/Dual (±) : 2.7V ~ 36V, ±1.35V ~ 18V
Operating Temperature : -40°C ~ 125°C
Mounting Type : Surface Mount
Package / Case : 8-SOIC (0.154", 3.90mm Width)
Supplier Device Package : 8-SOIC
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| PGA900ARHHT | TI | 36-VQFN (6x6) | New | 详细 | |
| UCC28502N | TI | 20-PDIP | New | 详细 | |
| TLV271IP | TI | 8-PDIP | New | 详细 | |
| BQ2084DBT-V123 | TI | 38-TSSOP | New | 详细 | |
| LM393TL | TI | 8-uSMD | New | 详细 | |
| LM89CIMX/NOPB | TI | 8-SOIC | New | 详细 | |
| UA78L05CLPE3 | TI | TO-92-3 | New | 详细 | |
| DRV8801AQRMJRQ1 | TI | 16-WQFN (4x4) | New | 详细 | |
| SN74LV132ADBR | TI | 14-SSOP | New | 详细 | |
| LMV393MX/NOPB | TI | 8-SOIC | New | 详细 | |
| OPA2137PA | TI | 8-PDIP | New | 详细 | |
| TLV70530YFPR | TI | 4-DSBGA (0.8x0.8) | New | 详细 | |
| BQ77910ADBT | TI | 38-TSSOP | New | 详细 | |
| TPA3111D1PWPR | TI | 28-HTSSOP | New | 详细 | |
| LP8553TLE/NOPB | TI | 25-DSBGA (2.46x2.46) | New | 详细 | |
| LM324DE4 | TI | 14-SOIC | New | 详细 | |
| SN74HC594DR | TI | 16-SOIC | New | 详细 | |
| TM4C1299KCZADI3 | TI | 212-NFBGA (10x10) | New | 详细 | |
| SN74LVC2G07YEPR | TI | 6-DSBGA, 6-WCSP (1.4x0.9) | New | 详细 | |
| TMS320BC52PZA57 | TI | 100-LQFP (14x14) | New | 详细 |
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