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罗斌森
  • TLV2254IDR

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : LinCMOS?
    Part Status : Active
    Amplifier Type : General Purpose
    Number of Circuits : 4
    Output Type : Rail-to-Rail
    Slew Rate : 0.12V/μs
    Gain Bandwidth Product : 200kHz
    Current - Input Bias : 1pA
    Voltage - Input Offset : 200μV
    Current - Supply : 140μA
    Current - Output / Channel : 50mA
    Voltage - Supply, Single/Dual (±) : 2.7V ~ 8V, ±1.35V ~ 4V
    Operating Temperature : -40°C ~ 125°C
    Mounting Type : Surface Mount
    Package / Case : 14-SOIC (0.154", 3.90mm Width)
    Supplier Device Package : 14-SOIC

极速报价

型号
品牌 封装 批号 查看
TPS65910AEVM-583 TI New 详细
DS90UB913ATRTVTQ1 TI 32-WQFN (5x5) New 详细
BQ24104RHLR TI 20-VQFN (3.5x4.5) New 详细
SN74LS04NSR TI 14-SOP New 详细
BQ25713RSNR TI New 详细
TPS7248QDR TI 8-SOIC New 详细
LP3995ILD-3.0 TI 6-WSON (2.92x3.29) New 详细
TMS3705BDRG4 TI 16-SOIC New 详细
LM3S1R21-IQC80-C5 TI 100-LQFP (14x14) New 详细
TS5V330CDR TI New 详细
SN74LVC1G86YZAR TI 5-DSBGA, 5-WCSP (1.4x0.9) New 详细
RM48L952DZWTT TI 337-NFBGA (16x16) New 详细
SN74S244DWR TI 20-SOIC New 详细
BQ25871YFFT TI 42-DSBGA New 详细
LP3982ILDX-ADJ/NOPB TI 8-WSON (3x2.5) New 详细
UCC2889D TI 8-SOIC New 详细
LP2985-33DBVTG4 TI SOT-23-5 New 详细
LP38690SDX-1.8/NOPB TI 6-WSON (3x3) New 详细
LM2679S-3.3/NOPB TI DDPAK/TO-263-7 New 详细
CY74FCT825ATSOCTG4 TI New 详细