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罗斌森
  • TLV2262IDR

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : LinCMOS?
    Part Status : Active
    Amplifier Type : General Purpose
    Number of Circuits : 2
    Output Type : Rail-to-Rail
    Slew Rate : 0.55V/μs
    Gain Bandwidth Product : 710kHz
    Current - Input Bias : 1pA
    Voltage - Input Offset : 300μV
    Current - Supply : 400μA
    Current - Output / Channel : 50mA
    Voltage - Supply, Single/Dual (±) : 2.7V ~ 8V, ±1.35V ~ 4V
    Operating Temperature : -40°C ~ 125°C
    Mounting Type : Surface Mount
    Package / Case : 8-SOIC (0.154", 3.90mm Width)
    Supplier Device Package : 8-SOIC

极速报价

型号
品牌 封装 批号 查看
LM2575HVT-5.0/LF03 TI TO-220-5 New 详细
JM38510/11904BPA TI 8-CDIP New 详细
LMP2016MM/NOPB TI 8-VSSOP New 详细
LMR33620CQ3RNXTQ1 TI 12-VQFN-HR (3x2) New 详细
PCM1754DBQR TI 16-SSOP New 详细
TPS51463RGET TI 24-VQFN (4x4) New 详细
THS10082CDA TI 32-TSSOP New 详细
BQ24751RHDR TI 28-VQFN (5x5) New 详细
UCC2808APWTR-1 TI 8-TSSOP New 详细
TPA3156D2DAD TI 32-HTSSOP New 详细
SN74LVTH241DW TI 20-SOIC New 详细
XTR114UG4 TI 14-SO New 详细
LM2594HVM-ADJ/NOPB TI 8-SOIC New 详细
UCC3818APW TI 16-TSSOP New 详细
LM3900DR TI 14-SOIC New 详细
TLE2074ACN TI 14-PDIP New 详细
SN74CBT3383DWR TI 24-SOIC New 详细
CD74HC377PWR TI New 详细
SN74LVC1G80QDCKRQ1 TI New 详细
LM2590HVS-3.3 TI DDPAK/TO-263-7 New 详细