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  • THS7314DR

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Part Status : Active
    Applications : Buffer
    Output Type : Rail-to-Rail
    Number of Circuits : 3
    Current - Supply : 16mA
    Current - Output / Channel : 70mA
    Voltage - Supply, Single/Dual (±) : 2.85V ~ 5.5V
    Mounting Type : Surface Mount
    Package / Case : 8-SOIC (0.154", 3.90mm Width)
    Supplier Device Package : 8-SOIC

极速报价

型号
品牌 封装 批号 查看
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MSP430FR5721IRHAT TI 40-VQFN (6x6) New 详细
TPD1E05U06QDPYRQ1 TI 2-X1SON (1x.60) New 详细
TSC2008IYZGT TI 12-DSBGA New 详细
TL3843BD-8 TI 8-SOIC New 详细
FPC202RHUT TI 56-WQFN (5x11) New 详细
SN74HCT138N TI 16-PDIP New 详细
LM3595LD/NOPB TI 10-WSON (3x3) New 详细
TPS76718QPWP TI 20-HTSSOP New 详细
LP3853ESX-2.5 TI DDPAK/TO-263-5 New 详细
SN74LVTH162240DGGR TI 48-TSSOP New 详细
TPS780330200DDCT TI SOT-23-5 New 详细
SN74LV139ADGVRG4 TI 16-TVSOP New 详细
SN74LVTH574GQNR TI New 详细
SN74LS646NT TI 24-PDIP New 详细
ADS5433IPJYG3 TI 52-QFP (10x10) New 详细
DS90LV047ATMTC TI New 详细