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  • THS7314DR

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Part Status : Active
    Applications : Buffer
    Output Type : Rail-to-Rail
    Number of Circuits : 3
    Current - Supply : 16mA
    Current - Output / Channel : 70mA
    Voltage - Supply, Single/Dual (±) : 2.85V ~ 5.5V
    Mounting Type : Surface Mount
    Package / Case : 8-SOIC (0.154", 3.90mm Width)
    Supplier Device Package : 8-SOIC

极速报价

型号
品牌 封装 批号 查看
OPA643N/250 TI SOT-23-5 New 详细
TRSF23243IDGGR TI 48-TSSOP New 详细
TMS320F28032PNT TI 80-LQFP (12x12) New 详细
TPS74901KTWT TI DDPAK/TO-263-7 New 详细
LM4041DIDCKR TI SC-70-5 New 详细
LP5912Q3.0DRVRQ1 TI 6-WSON (2x2) New 详细
TRSF3238IDWR TI 28-SOIC New 详细
TPS61007DGS TI 10-VSSOP New 详细
TL5001CD TI 8-SOIC New 详细
LM3100EVAL TI New 详细
TRS3222CDWG4 TI 20-SOIC New 详细
TMS320DM6437ZWTQ6 TI 361-NFBGA (16x16) New 详细
LM3S1N16-IQR50-C3T TI 64-LQFP (10x10) New 详细
SN65C3222EPWR TI 20-TSSOP New 详细
MSP430F2011IRSAR TI 16-QFN (4x4) New 详细
LMC7221AIM/NOPB TI 8-SOIC New 详细
TPS77930DGKRG4 TI 8-VSSOP New 详细
74CBTK16245DGVRG4 TI 48-TVSOP New 详细
TLV2332ID TI 8-SOIC New 详细
TAS5414BTPHDRQ1 TI 64-HTQFP (14x14) New 详细