产品系列

罗斌森
  • THS770006IRGER

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Part Status : Active
    Type : ADC Driver
    Applications : Data Acquisition
    Mounting Type : Surface Mount
    Package / Case : 24-VFQFN Exposed Pad
    Supplier Device Package : 24-VQFN (4x4)

极速报价

型号
品牌 封装 批号 查看
LP2981-28DBVRE4 TI SOT-23-5 New 详细
UC3625QG4 TI 28-PLCC (11.51x11.51) New 详细
TPS92690Q1PWPR/NOPB TI 16-HTSSOP New 详细
OPA322SAIDBVR TI SOT-23-6 New 详细
CCB3Q3306AMPWREP TI New 详细
SCAN162512ASM/NOPB TI 64-NFBGA (8x8) New 详细
SN74LVC2G66YEAR TI 8-DSBGA, 8-WCSP (1.9x0.9) New 详细
LP8345CDTX-3.3/NOPB TI TO-252-3 New 详细
INA195AQDBVRQ1 TI SOT-23-5 New 详细
SN74LVC16244ADGG TI 48-TSSOP New 详细
CDCS501PW TI 8-TSSOP New 详细
LMR10515XMFX/NOPB TI SOT-23-5 New 详细
OPA544FKTTTG3 TI DDPAK/TO-263-5 New 详细
ADS1112IDGSR TI 10-VSSOP New 详细
LP2981IM5X-3.0/NOPB TI SOT-23-5 New 详细
SN74ALS533ANSR TI 20-SO New 详细
LM4912MMX/NOPB TI 10-VSSOP New 详细
LM3450MT/NOPB TI 16-TSSOP New 详细
TPS2H000AQPWPRQ1 TI 16-HTSSOP New 详细
OPA691ID TI 8-SOIC New 详细