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罗斌森
  • THS770006IRGER

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Part Status : Active
    Type : ADC Driver
    Applications : Data Acquisition
    Mounting Type : Surface Mount
    Package / Case : 24-VFQFN Exposed Pad
    Supplier Device Package : 24-VQFN (4x4)

极速报价

型号
品牌 封装 批号 查看
TCAN330D TI 8-SOIC New 详细
TLC555ID TI 8-SOIC New 详细
TPD2F702YFKR TI New 详细
TPS2020IDRQ1 TI 8-SOIC New 详细
BQ4847MT TI 28-DIP Module (18.42x38.8) New 详细
PCM1704U-J TI 20-SO New 详细
LM1771TMM/NOPB TI 8-VSSOP New 详细
REG103UA-2.5/2K5 TI 8-SOIC New 详细
PT78ST153H TI New 详细
SN74ABT16853DLG4 TI 56-SSOP New 详细
BQ24027DRCTG4 TI 10-VSON (3x3) New 详细
SN74AS805BDWRE4 TI 20-SOIC New 详细
MC3403PW TI 14-TSSOP New 详细
TRF2443IPFP TI 80-HTQFP (12x12) New 详细
TLC7725QPG4 TI 8-PDIP New 详细
SN74LVCH16374ADGVR TI New 详细
ADS8345EB/2K5 TI 20-SSOP/QSOP New 详细
LM5104SDX TI 10-WSON (4x4) New 详细
SN74FB2033ARCR TI 52-QFP (10x10) New 详细
SN74AC373PWR TI 20-TSSOP New 详细