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罗斌森
  • THS770006IRGET

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Part Status : Active
    Type : ADC Driver
    Applications : Data Acquisition
    Mounting Type : Surface Mount
    Package / Case : 24-VFQFN Exposed Pad
    Supplier Device Package : 24-VQFN (4x4)

极速报价

型号
品牌 封装 批号 查看
TPIC46L03DBRG4 TI 28-SSOP New 详细
CD74HC195PWT TI 16-TSSOP New 详细
TL7715ACD TI 8-SOIC New 详细
LM25017SDX/NOPB TI 8-WSON (4x4) New 详细
LM2678SX-3.3 TI DDPAK/TO-263-7 New 详细
TPS259570DSGR TI 8-WSON (2x2) New 详细
SN74S174NSRE4 TI New 详细
CDCS503TPWRQ1 TI 8-TSSOP New 详细
TLC082QDGNRQ1 TI 8-MSOP-PowerPad New 详细
DAC715PKG4 TI 28-PDIP New 详细
TL431BILPRE3 TI TO-92-3 New 详细
LMK62A2-150M00SIAT TI 6-QFM (5x3.2) New 详细
LMV358MX/NOPB TI 8-SOIC New 详细
LP38693MP-1.8/NOPB TI SOT-223-5 New 详细
SN74LS109AD TI New 详细
LM2687MMX TI 8-VSSOP New 详细
ADS8910BEVM-PDK TI New 详细
ADS6443IRGC25 TI 64-VQFN (9x9) New 详细
SN74LV574APWR TI New 详细
TL054CDBRG4 TI 14-SSOP New 详细